Patents by Inventor Meer Sakib

Meer Sakib has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10009668
    Abstract: As photonics evolves closer and closer to the electronic processing elements in order to meet the demands of speed, latency of evolving data communications networks and data centers the inventors, rather than seeking direct monolithically integrated CMOS based processing photonic and electronic elements, have established a different route. Namely replace the computer hubs/electrical bridges interconnecting the multiple core logic chipset elements with a photonic bridge. In this manner high risk chip-to-chip photonic point-to-point links are replaced with photonic SOCs that leverage photonics bandwidth density attribute rather than its bandwidth distance attributes. An SOI based Electronic Embedded Photonic Switching Fabric is presented supporting, for example, N×MGb/s interconnections exploiting N channels of MGb/s wherein each channel of exploits S WDM channels of TGb/s. Embodiments of the invention also support high density optical interconnection via vertical grating couplers and multicore fibers.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: June 26, 2018
    Assignee: THE ROYAL INSTITUTION FOR THE ADVANCEMENT OF LEARNING / MCGILL UNIVERSITY
    Inventors: Odile Liboiron-Ladouceur, Md. Shafiqul Hai, Monireh Moayedi Pour Fard, Chunshu Zhang, Meer Sakib
  • Publication number: 20160156999
    Abstract: As photonics evolves closer and closer to the electronic processing elements in order to meet the demands of speed, latency of evolving data communications networks and data centres the inventors, rather than seeking direct monolithically integrated CMOS based processing photonic and electronic elements, have established a different route. Namely replace the computer hubs/electrical bridges interconnecting the multiple core logic chipset elements with a photonic bridge. In this manner high risk chip-to-chip photonic point-to-point links are replaced with photonic SOCs that leverage photonics bandwidth density attribute rather than its bandwidth distance attributes. An SOI based Electronic Embedded Photonic Switching Fabric is presented supporting, for example, N×MGb/s interconnections exploiting N channels of MGb/s wherein each channel of exploits S WDM channels of TGb/s. Embodiments of the invention also support high density optical interconnection via vertical grating couplers and multicore fibers.
    Type: Application
    Filed: December 1, 2015
    Publication date: June 2, 2016
    Inventors: Odile Liboiron-Ladouceur, Md. Shafiqul Hai, Monireh Moayedi Pour Fard, Chunshu Zhang, Meer Sakib