Patents by Inventor Meeyoung H. Yoon

Meeyoung H. Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7598616
    Abstract: A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: October 6, 2009
    Assignee: International Business Machines Corporation
    Inventors: Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon
  • Patent number: 7563710
    Abstract: A method of forming a damascene wire. The method including: forming a mask layer on a top surface of a dielectric layer; forming an opening in the mask layer; forming a trench in the dielectric layer where the dielectric layer is not protected by the mask layer; recessing the sidewalls of the trench under the mask layer; forming a conformal conductive liner on all exposed surface of the trench and the mask layer; filling the trench with a core electrical conductor; removing portions of the conductive liner extending above the top surface of the dielectric layer and removing the mask layer; and forming a conductive cap on a top surface of the core conductor.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: July 21, 2009
    Assignee: International Business Machines Corporation
    Inventors: Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon
  • Patent number: 7528493
    Abstract: A damascene wire and method of forming the wire. The method including: forming a mask layer on a top surface of a dielectric layer; forming an opening in the mask layer; forming a trench in the dielectric layer where the dielectric layer is not protected by the mask layer; recessing the sidewalls of the trench under the mask layer; forming a conformal conductive liner on all exposed surface of the trench and the mask layer; filling the trench with a core electrical conductor; removing portions of the conductive liner extending above the top surface of the dielectric layer and removing the mask layer; and forming a conductive cap on a top surface of the core conductor. The structure includes a core conductor clad in a conductive liner and a conductive capping layer in contact with the top surface of the core conductor that is not covered by the conductive liner.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: May 5, 2009
    Assignee: International Business Machines Corporation
    Inventors: Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon
  • Publication number: 20080246151
    Abstract: A damascene wire and method of forming the wire. The method including: forming a mask layer on a top surface of a dielectric layer; forming an opening in the mask layer; forming a trench in the dielectric layer where the dielectric layer is not protected by the mask layer; recessing the sidewalls of the trench under the mask layer; forming a conformal conductive liner on all exposed surface of the trench and the mask layer; filling the trench with a core electrical conductor; removing portions of the conductive liner extending above the top surface of the dielectric layer and removing the mask layer; and forming a conductive cap on a top surface of the core conductor. The structure includes a core conductor clad in a conductive liner and a conductive capping layer in contact with the top surface of the core conductor that is not covered by the conductive liner.
    Type: Application
    Filed: June 17, 2008
    Publication date: October 9, 2008
    Inventors: Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon
  • Patent number: 7335588
    Abstract: A damascene wire and method of forming the wire. The method including: forming a mask layer on a top surface of a dielectric layer; forming an opening in the mask layer; forming a trench in the dielectric layer where the dielectric layer is not protected by the mask layer; recessing the sidewalls of the trench under the mask layer; forming a conformal conductive liner on all exposed surface of the trench and the mask layer; filling the trench with a core electrical conductor; removing portions of the conductive liner extending above the top surface of the dielectric layer and removing the mask layer; and forming a conductive cap on a top surface of the core conductor. The structure includes a core conductor clad in a conductive liner and a conductive capping layer in contact with the top surface of the core conductor that is not covered by the conductive liner.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: February 26, 2008
    Assignee: International Business Machines Corporation
    Inventors: Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon