Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

Abstract: A moldable interconnect device for providing an electrical connection between two or more opposing arrays of contacts for establishing an electrical circuit. The moldable interconnect device having an insulting substrate and an array of conductive elements held in the insulating substrate, the conductive elements are made of an elastomeric conductive composite. The composite having a polymeric matrix comprising a crosslinked polymer. The polymer having a curing agent for catalyzing crosslinking of the polymer matrix and conductive metal particles and non-conductive compressible rubber particles dispersed with the polymer matrix. The non-conductive compressible rubber particles having a greater compressibility than the elastomeric conductive composite that is the same as the elastomeric conductive composite but free of non-conductive compressible rubber particles.

Abstract: An electrical connector assembly is provided and includes a carrier having an upper surface and a lower surface. The lower surface is configured to face a host circuit board. The upper surface is configured to face a component circuit board of an electrical component. The carrier includes a plurality of contact openings therethrough. The electrical connector assembly includes contacts coupled to the carrier and passing through the corresponding contact openings. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The conductive polymer column is compressible between the upper mating interface and the lower mating interface. The conductive polymer column includes an inner core and an outer support body. The inner core is manufactured from a first material. The outer support body is manufactured from a second material. The second material has a lower compression set than the first material.

Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

Abstract: An electrical connector assembly is provided and includes a carrier having an upper surface and a lower surface. The lower surface is configured to face a host circuit board. The upper surface is configured to face a component circuit board of an electrical component. The carrier includes a plurality of contact openings therethrough. The electrical connector assembly includes contacts coupled to the carrier and passing through the corresponding contact openings. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The conductive polymer column is compressible between the upper mating interface and the lower mating interface. The conductive polymer column includes an inner core and an outer support body. The inner core is manufactured from a first material. The outer support body is manufactured from a second material. The second material has a lower compression set than the first material.

Abstract: A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.

Abstract: A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.

Abstract: An elastomeric conductive composite for use in a moldable interconnect is provided, said composite having a polymeric matrix containing a crosslinked polymer, a curing agent for catalyzing crosslinking of the polymeric matrix, conductive metal particles and nonconductive compressible rubber particles dispersed within the polymeric matrix. The nonconductive compressible rubber particles have a greater compressibility than an elastomeric conductive composite that is the same as the elastomeric conductive composite but is free of non-conductive compressible rubber particles. A moldable interconnect containing the elastomeric conductive composite is also provided. This interconnect can be used to provide electrical connection between two or more opposing contacts or arrays of contacts for establishing at least one electrical circuit.

Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

Abstract: A method of forming a composite article, wherein the method includes providing a composite formulation, the composite formulation including a polymer matrix and at least one additive distributed in the polymer matrix at a concentration of between 10% and 50%, by volume, the at least one additive having a molar percentage of carbon that is equal to or less than 90%, feeding the composite formulation to a printing head of an additive manufacturing device, heating the composite formulation to form a heated composite formulation, extruding the heated composite formulation through a nozzle in the printing head, and depositing the heated composite formulation onto a platform to form the composite article. Also provided is a composite article produced from a composite formulation having at least one additive distributed in a polymer matrix.