Patents by Inventor Megan J. Shannon

Megan J. Shannon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI shielding for semiconductor chip carriers
    Patent number: 6740959
    Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: May 25, 2004
    Assignee: International Business Machines Corporation
    Inventors: David James Alcoe, Jeffrey Thomas Coffin, Michael Anthony Gaynes, Harvey Charles Hamel, Mario J. Interrante, Brenda Lee Peterson, Megan J. Shannon, William Edward Sablinski, Christopher Todd Spring, Randall Joseph Stutzman, Renee L. Weisman, Jeffrey Allen Zitz
  • Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
    Patent number: 6548175
    Abstract: The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: April 15, 2003
    Assignee: International Business Machines Corporation
    Inventors: Krishna G. Sachdev, Raymond A. Jackson, Amy B. Ostrander, Charles H. Perry, Megan J. Shannon
  • EMI shielding for semiconductor chip carriers
    Publication number: 20030025180
    Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.
    Type: Application
    Filed: August 1, 2001
    Publication date: February 6, 2003
    Applicant: International Business Machines Corporation
    Inventors: David James Alcoe, Jeffrey Thomas Coffin, Michael Anthony Gaynes, Harvey Charles Hamel, Mario J. Interrante, Brenda Lee Peterson, Megan J. Shannon, William Edward Sablinski, Christopher Todd Spring, Randall Joseph Stutzman, Renee L. Weisman, Jeffrey Allen Zitz
  • Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
    Publication number: 20020127406
    Abstract: The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.
    Type: Application
    Filed: January 11, 2001
    Publication date: September 12, 2002
    Applicant: International Business Machines Corporation
    Inventors: Krishna G. Sachdev, Raymond A. Jackson, Amy B. Ostrander, Charles H. Perry, Megan J. Shannon