Abstract: Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate.

Abstract: Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate.

Abstract: Disclosed herein is a method for doping a substrate, comprising disposing a coating of a composition comprising a dopant-containing polymer and a non-polar solvent on a substrate; and annealing the substrate at a temperature of 750 to 1300° C. for 1 second to 24 hours to diffuse the dopant into the substrate; wherein the dopant-containing polymer is a polymer having a covalently bound dopant atom; wherein the dopant-containing polymer is free of nitrogen and silicon; and wherein the method is free of a step of forming an oxide capping layer over the coating prior to the annealing step.

Abstract: Disclosed herein is a method for doping a substrate, comprising disposing a coating of a composition comprising a dopant-containing polymer and a non-polar solvent on a substrate; and annealing the substrate at a temperature of 750 to 1300° C. for 1 second to 24 hours to diffuse the dopant into the substrate; wherein the dopant-containing polymer is a polymer having a covalently bound dopant atom; wherein the dopant-containing polymer is free of nitrogen and silicon; and wherein the method is free of a step of forming an oxide capping layer over the coating prior to the annealing step.