Abstract: An electronic device may include a printed circuit board. The electronic device may include a first core with a first cavity, the first core formed from an organic material, and the first cavity configured to house a DC capacitor for delivery of direct current to a die from a voltage source. The device may include a second core with a second cavity, the second core formed from an inorganic material and the second cavity configured to house an AC capacitor coupled to an output of the die for decoupling alternating current effects associated with the direct current. The device may include an interposer layer disposed between the first core and the second core, configured to isolate the first core and the second core.

Abstract: A scalable high-impedance component (SHIC) may include a flexible polyimide core may include one or more vias. The SHIC may include a magnetic film formed on one or more sides of the flexible polyimide core. The SHIC may include a polymer layer formed on the magnetic film, the polymer layer isolating the magnetic film and the flexible polyimide core. The SHIC may include a metal layer formed on the polymer layer and within the vias, such that the metal layer forms windings that extend through the one or more vias. The SHIC may include a magnetic paste disposed on the metal layer such that the SHIC shields a desired frequency of electromagnetic interference.

Abstract: A shielding structure for a semiconductor device may include a first segment formed from a first set of layers including a first metal and a second metal. The structure may include a second segment formed from a second set of layers. The second set of layers may include the first metal and the second metal, the second segment orthogonal to the first segment, where the second segment is configured to be inserted into a trench in a substrate of the semiconductor device.

Abstract: An inductor may include a flexible polyimide flexible core may including one or more cavities. The inductor may include a magnetic film, formed on two sides of the flexible polyimide flexible core and on a respective sidewall of each of the one or more cavities. The inductor may include a dielectric layer formed on the magnetic film. The inductor may also include a metal layer formed on the dielectric layer and within the cavities, such that vias are formed on one or more sides of the inductor and extend through the one or more cavities.

Abstract: A chiplet-based system may include a first chiplet mounted to an interposer that is designated as being from one or more trusted sources, a second chiplet mounted to the interposer that is designated as not being from the one or more trusted sources, and an artificial intelligence (AI) accelerator. The AI accelerator may be programmed to monitor a state of the first chiplet, where the state may indicate an anomaly associated with the second chiplet. The AI accelerator may then select an action from a plurality of actions based at least in part on the state of the first chiplet, cause the action to be performed by the chiplet-based system, and execute a reinforcement learning algorithm update the plurality of actions based on a result of the action being performed.

Abstract: An integrated voltage regulator (IVR) for on-chip integrated circuit applications may include a tunable inductor that may be adjusted to generate a target output for the IVR. The tunable inductor may include a piezoelectric material that may cause the relative permeability of the inductor to change based on an applied stimulus voltage. A control circuit may receive a target value, such as a target output voltage, and retrieve or calculate a target inductance value or voltage to be applied to the inductor to generate the target output value. A feedback circuit may monitor the output value and adjust the switching frequency or voltage applied to the inductor during operation in order to adjust the output value.