Abstract: An oxide removing apparatus includes: a chamber; a discharge section configured to discharge a fluid from the chamber; a heating section configured to heat an object; a reducing gas supply section having a gasification device configured to produce a reducing gas; and a controller. The controller controls each component such that, after substantially all the fluid in the chamber is discharged, the reducing gas substantially fills the chamber at a pressure that is equal to or higher than 1000 Pa and lower than a saturated vapor pressure of the reducing gas, while the object is heated.

Abstract: A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to house the stage 13 and the cover 16; a heater 15 configured to heat the substrate W on the stage 13; and a reducing gas supply device 19 configured to supply a reducing gas F. A method for manufacturing a soldered product includes, by using the soldered product manufacturing device 1, placing the substrate W on the stage 13; covering the substrate W placed on the stage 13 with the cover 16; heating the substrate W; and supplying the reducing gas F into the chamber 11.