Patents by Inventor Megumi Chiyoda

Megumi Chiyoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7198525
    Abstract: The card edge connector includes a housing and a card edge terminal. A plurality of through holes is formed on the housing. A cable is electrically connected to the card edge terminal. The card edge terminal to which the cable is attached by crimping is pressed and inserted into a plurality of through holes on the housing. Conductor areas are provided on the surface and the back of the substrate. The substrate is inserted and fitted into the housing and also held by the holding part of the card edge terminal which is pressed and inserted into the housing and electrically conducted to the conductor areas.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: April 3, 2007
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Akira Nagamine, Megumi Chiyoda
  • Publication number: 20060138637
    Abstract: The card edge connector includes a housing and a card edge terminal. A plurality of through holes is formed on the housing. A cable is electrically connected to the card edge terminal. The card edge terminal to which the cable is attached by crimping is pressed and inserted into a plurality of through holes on the housing. Conductor areas are provided on the surface and the back of the substrate. The substrate is inserted and fitted into the housing and also held by the holding part of the card edge terminal which is pressed and inserted into the housing and electrically conducted to the conductor areas.
    Type: Application
    Filed: December 22, 2005
    Publication date: June 29, 2006
    Applicant: J.S.T. Mfg. Co., Ltd.
    Inventors: Akira Nagamine, Megumi Chiyoda
  • Patent number: 7021956
    Abstract: An insulation displacement terminal is formed entirely of an integral metal sheet. The terminal includes first and second plate-like insulation displacement groove-forming portions opposed to each other in a first direction along which an insulated wire extends. Each of the insulation displacement groove-forming portions has an insulation displacement blade of a U-shape defining an insulation displacement groove. Bottom portions of the insulation displacement groove-forming portions are interconnected by an interconnecting portion. A lead extends downwardly from one side edge of the interconnecting portion. A holding space for an insulation of the insulated wire is formed between a pair of plate portions which are formed respectively at opposite side edges of the first insulation displacement groove-forming portion by bending. Each of the plate portions has a retaining projection and a bendable piece portion.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: April 4, 2006
    Assignee: J.S.T.Mfg. Co., Ltd.
    Inventors: Akira Goto, Yoshikazu Takagi, Kazushi Miyahara, Megumi Chiyoda
  • Patent number: 6971903
    Abstract: The insulation displacement terminal 3 is retained on the terminal retainer portion 5 of the main housing 6. The lead 12 of the insulation displacement terminal 3 is soldered to the first surface 10a of the circuit board 10 through the bottom plate 13 of the main housing 6 and the circuit board 10, which is held in the second retaining space 11 between the main housing 6 and second cover housing 8. After the insulation displacement terminal 3 in such a subassembly state is connected by insulation displacement with a desired portion of the insulated wire 2, the first cover housing 7 is combined with the main housing 6. The receiving portion 44 of the second cover housing 8 receives the insulation displacement load via the bottom plate 13 of the main housing 6 and the circuit board 10.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: December 6, 2005
    Assignee: J.S.T.Mfg. Co.,Ltd.
    Inventors: Akira Goto, Yoshikazu Takagi, Kazushi Miyahara, Megumi Chiyoda
  • Publication number: 20050106927
    Abstract: The insulation displacement terminal 3 is retained on the terminal retainer portion 5 of the main housing 6. The lead 12 of the insulation displacement terminal 3 is soldered to the first surface 10a of the circuit board 10 through the bottom plate 13 of the main housing 6 and the circuit board 10, which is held in the second retaining space 11 between the main housing 6 and second cover housing 8. After the insulation displacement terminal 3 in such a subassembly state is connected by insulation displacement with a desired portion of the insulated wire 2, the first cover housing 7 is combined with the main housing 6. The receiving portion 44 of the second cover housing 8 receives the insulation displacement load via the bottom plate 13 of the main housing 6 and the circuit board 10.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 19, 2005
    Applicant: J.S.T. Mfg. Co., Ltd.
    Inventors: Akira Goto, Yoshikazu Takagi, Kazushi Miyahara, Megumi Chiyoda
  • Publication number: 20050079754
    Abstract: An insulation displacement terminal 3 is formed entirely of an integral metal sheet. The terminal includes first and second plate-like insulation displacement groove-forming portions 71 and 72 opposed to each other in a first direction X along which an insulated wire extends. Each of the insulation displacement groove-forming portions 71 and 72 has an insulation displacement blade 74 of a U-shape defining an insulation displacement groove 73. Bottom portions of the insulation displacement groove-forming portions 71 and 72 are interconnected by an interconnecting portion 75. A lead 12 extends downwardly from one side edge of the interconnecting portion 75. A holding space R for an insulation of the insulated wire is formed between a pair of plate portions 78 and 79 which are formed respectively at opposite side edges of the first insulation displacement groove-forming portion 71 by bending. Each of the plate portions 78 and 79 has a retaining projection 80 and a bendable piece portion 81.
    Type: Application
    Filed: November 21, 2002
    Publication date: April 14, 2005
    Inventors: Akira Goto, Yoshikazu Takagi, Kazushi Miyahara, Megumi Chiyoda