Patents by Inventor Megumi Kawakami

Megumi Kawakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including a power MISFET
    Patent number: 8482058
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: July 9, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
    Publication number: 20120235250
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Application
    Filed: June 1, 2012
    Publication date: September 20, 2012
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device including a power MISFET and method of manufacturing the same
    Patent number: 8232595
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: July 31, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
    Publication number: 20110220999
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Application
    Filed: May 19, 2011
    Publication date: September 15, 2011
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrate
    Patent number: 7982263
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: July 19, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • SEMICONDUCTOR DEVICE HAVING A PLURALITY OF MISFETS FORMED ON A MAIN SURFACE OF A SEMICONDUCTOR SUBSTRATE
    Publication number: 20100044793
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d(M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Application
    Filed: October 30, 2009
    Publication date: February 25, 2010
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device and a method of manufacturing the same
    Publication number: 20070114606
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Application
    Filed: January 4, 2007
    Publication date: May 24, 2007
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Power mosfet having conductor plug structured contacts
    Patent number: 7176523
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: February 13, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device and a method of manufacturing the same
    Publication number: 20050017296
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Application
    Filed: August 19, 2004
    Publication date: January 27, 2005
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device and method of manufacturing the same
    Patent number: 6797594
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: September 28, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device and a method of manufacturing the same
    Patent number: 6605842
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: August 12, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device and a method of manufacturing the same
    Patent number: 6528848
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: March 4, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device and a method of manufacturing the same
    Publication number: 20020167088
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Application
    Filed: July 2, 2002
    Publication date: November 14, 2002
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa
  • Semiconductor device and a method of manufacturing the same
    Publication number: 20010012671
    Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, lid (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).
    Type: Application
    Filed: February 14, 2001
    Publication date: August 9, 2001
    Inventors: Yutaka Hoshino, Shuji Ikeda, Isao Yoshida, Shiro Kamohara, Megumi Kawakami, Tomoyuki Miyake, Masatoshi Morikawa