Patents by Inventor Megumi Kodama

Megumi Kodama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142676
    Abstract: There is provided a compound represented by General Formula (I), a composition containing the compound represented by General Formula (I), a cured product, an optically anisotropic body, an optical element, and a light guide element. P1 and P2 each independently represent a hydrogen atom, —CN, —NCS, or a polymerizable group. However, at least one of P1 or P2 represents a polymerizable group. Sp1 and Sp2 each independently represent a specific group. A1, A2, A3, and A4 each independently represent an aromatic hydrocarbon ring group or aromatic heterocyclic group which may have a specific substituent. Z1 and Z2 each independently represent a specific linking group or a single bond. B1 represents a group represented by a specific formula. n1 and n2 each independently represent an integer of 0 to 2.
    Type: Application
    Filed: December 21, 2023
    Publication date: May 2, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Yuki FUKUSHIMA, Megumi OKUBO, Keisuke KODAMA, Shunya KATOH, Kiyoshi TAKEUCHI
  • Patent number: 10807830
    Abstract: Provided is a winding core which has a cylindrical shape and on which an adhesive tape, formed by an adhesive layer formed on an elongated base film in the longitudinal direction of the base film, is wound as multiple layers, wherein the outer diameter of the winding core is a dimension in which a deviation amount of the adhesive layer in the circumferential direction of the winding core between adjacent inner and outer tape portions of the adhesive tape in the radial direction of the winding core becomes 55 mm or less when the adhesive tape is wound on the winding core.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: October 20, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Megumi Kodama, Takahiro Tokuyasu, Shouta Sugai
  • Patent number: 9212298
    Abstract: The adhesive sheet of the invention comprises a resin composition containing (A) a high-molecular-weight component, (B1) a thermosetting component having a softening point of below 50° C., (B2) a thermosetting component having a softening point of between 50° C. and 100° C. and (C) a phenol resin having a softening point of no higher than 100° C., the composition containing 11 to 22 mass % of the (A) high-molecular-weight component, 10 to 20 mass % of the (B1) thermosetting component having a softening point of below 50° C., 10 to 20 mass % of the (B2) thermosetting component having a softening point of between 50° C. and 100° C. and 15 to 30 mass % of the phenol resin having a softening point of no higher than 100° C., based on 100 mass % of the resin composition.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: December 15, 2015
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Megumi Kodama, Takahiro Tokuyasu, Tetsurou Iwakura
  • Publication number: 20150129706
    Abstract: Provided is a winding core which has a cylindrical shape and on which an adhesive tape, formed by an adhesive layer formed on an elongated base film in the longitudinal direction of the base film, is wound as multiple layers, wherein the outer diameter of the winding core is a dimension in which a deviation amount of the adhesive layer in the circumferential direction of the winding core between adjacent inner and outer tape portions of the adhesive tape in the radial direction of the winding core becomes 55 mm or less when the adhesive tape is wound on the winding core.
    Type: Application
    Filed: May 24, 2013
    Publication date: May 14, 2015
    Inventors: Megumi Kodama, Takahiro Tokuyasu, Shouta Sugai
  • Publication number: 20150050780
    Abstract: The adhesive sheet of the invention comprises a resin composition containing (A) a high-molecular-weight component, (B1) a thermosetting component having a softening point of below 50° C., (B2) a thermosetting component having a softening point of between 50° C. and 100° C. and (C) a phenol resin having a softening point of no higher than 100° C., the composition containing 11 to 22 mass % of the (A) high-molecular-weight component, 10 to 20 mass % of the (B1) thermosetting component having a softening point of below 50° C., 10 to 20 mass % of the (B2) thermosetting component having a softening point of between 50° C. and 100° C. and 15 to 30 mass % of the phenol resin having a softening point of no higher than 100° C., based on 100 mass % of the resin composition.
    Type: Application
    Filed: March 5, 2013
    Publication date: February 19, 2015
    Inventors: Megumi Kodama, Takahiro Tokuyasu, Tetsurou Iwakura
  • Publication number: 20120114934
    Abstract: The present invention relates to a bonding sheet including: an adhesive layer of an adhesive composition having a high-molecular weight component (A) and a thermosetting component (B) formed into a sheet, wherein a ratio (PCN/PCO) of a peak height near 2240 cm?1 derived from a nitrile group (PCN) to a peak height near 1730 cm?1 derived from a carbonyl group (PCO) is 0.03 or less in an IR spectrum of the high-molecular weight component (A).
    Type: Application
    Filed: May 11, 2010
    Publication date: May 10, 2012
    Inventors: Megumi Kodama, Takahiro Tokuyasu, Tetsurou Iwakura