Patents by Inventor Megumi Maruyama

Megumi Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate plating method and apparatus
    Publication number: 20020064591
    Abstract: A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits (10) to fill the fine pits with a metal (13) and includes performing a first plating process (11) by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process (12) by immersing the substrate in a second plating solution having a composition superior in leveling ability.
    Type: Application
    Filed: December 18, 2001
    Publication date: May 30, 2002
    Inventors: Akihisa Hongo, Mizuki Nagai, Kanji Ohno, Ryoichi Kimizuka, Megumi Maruyama