Abstract: An electronic panel includes insulation films that cover metal wirings and have plated through holes which expose parts of the respective metal wirings, oxide semiconductor films that electrically conducted with the metal wirings via the plated through holes formed on the insulation films, and an electrical component that includes electrodes which are electrically connected to the oxide semiconductor films. The oxide semiconductor film includes first and second portions in which the widths thereof are different from each other. The width of the first portion is wider than the width of the second portion. A portion faces a part of the metal wiring which is exposed from the plated through hole, and the portion is electrically connected to the part of the metal wiring. At least a part of the second portion faces the electrode of the electrical component and is electrically connected to the electrode.

Abstract: An electronic panel includes insulation films that cover metal wirings and have plated through holes which expose parts of the respective metal wirings, oxide semiconductor films that electrically conducted with the metal wirings via the plated through holes formed on the insulation films, and an electrical component that includes electrodes which are electrically connected to the oxide semiconductor films. The oxide semiconductor film includes first and second portions in which the widths thereof are different from each other. The width of the first portion is wider than the width of the second portion. A portion faces a part of the metal wiring which is exposed from the plated through hole, and the portion is electrically connected to the part of the metal wiring. At least a part of the second portion faces the electrode of the electrical component and is electrically connected to the electrode.