Patents by Inventor Megumi SUDO

Megumi SUDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240218215
    Abstract: A composition for temporary bonding with excellent compatibility, suitability for spin coating process, heat resistance, and suitability for various release processes. The composition includes: (A) a bifunctional (meth)acrylate not having a cyclic structure; (B) a bifunctional (meth)acrylate having a cyclic structure; and (C) a photo radical polymerization initiator.
    Type: Application
    Filed: April 26, 2022
    Publication date: July 4, 2024
    Applicant: DENKA COMPANY LIMITED
    Inventors: Tometomo UCHIDA HAMAGUCHI, Takako TANIGAWA HOSHINO, Megumi SUDO, Hiromi OKUMURA, Jun YOSHIDA
  • Publication number: 20230193090
    Abstract: A composition for temporary bonding, includes: (A) a (meth)acrylate having the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and homopolymer has a Tg of ?100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and/or a polyisobutene copolymer; and (C) a photo radical polymerization initiator.
    Type: Application
    Filed: May 17, 2021
    Publication date: June 22, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Tometomo UCHIDA, Toru ARAI, Takashi DOMOTO, Takako TANIGAWA, Jun WATANABE, Megumi SUDO, Jun YOSHIDA