Patents by Inventor Megumi Takemoto

Megumi Takemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11941991
    Abstract: According to one embodiment, a platooning operation system organizes a platoon by making a plurality of vehicles cooperate. The platooning operation system includes an application acceptance processor and a platoon organization processor. The application acceptance processor accepts an application of a vehicle for admission to the platoon. The platoon organization processor which selects a platoon to which the vehicle is to be admitted or determines possibility of admission of the vehicle to the platoon, based on at least one of information on a driver driving the vehicle and information on the vehicle.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: March 26, 2024
    Assignee: TOSHIBA DIGITAL SOLUTIONS CORPORATION
    Inventors: Megumi Kobayashi, Yasuto Hatafuku, Hideki Kubo, Motokazu Iwasaki, Yoko Ikeda, Shinsuke Iuchi, Kiyoshi Takemoto, Kaori Kitami, Keishi Higashi, Tatsuki Shiraishi, Michiyo Sato, Masaru Watabiki
  • Patent number: 7825677
    Abstract: A test jig is for testing electrical characteristics of a high frequency semiconductor device in a package having a ground electrode and a high frequency signal electrode. The test jig includes a test circuit substrate with a microstrip line structure, a grounding block and a high frequency signal contact pin. The test circuit substrate includes an insulating substrate, a ground conductor on a bottom surface of the insulating substrate and high frequency signal wiring on a top surface of the insulating substrate. The grounding block is disposed on the top surface of the insulating substrate and connected to the ground conductor. The high frequency signal contact pin is disposed on the top surface of the insulating substrate and connected to the high frequency signal wiring. The high frequency signal contact pin is spaced from the grounding block.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: November 2, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventors: Megumi Takemoto, Tomoyuki Kamiyama
  • Publication number: 20100052722
    Abstract: A test jig is for testing electrical characteristics of a high frequency semiconductor device in a package having a ground electrode and a high frequency signal electrode. The test jig includes a test circuit substrate with a microstrip line structure, a grounding block and a high frequency signal contact pin. The test circuit substrate includes an insulating substrate, a ground conductor on a bottom surface of the insulating substrate and high frequency signal wiring on a top surface of the insulating substrate. The grounding block is disposed on the top surface of the insulating substrate and connected to the ground conductor. The high frequency signal contact pin is disposed on the top surface of the insulating substrate and connected to the high frequency signal wiring. The high frequency signal contact pin is spaced from the grounding block.
    Type: Application
    Filed: January 14, 2009
    Publication date: March 4, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Megumi Takemoto, Tomoyuki Kamiyama
  • Patent number: 7276923
    Abstract: A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t?r?35t where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 ?m to 30 ?m and larger than that of the second curved surface.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: October 2, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki
  • Patent number: 7274195
    Abstract: A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t?r?35t, where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 ?m to 30 ?m and larger than that of the second curved surface.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: September 25, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki
  • Publication number: 20060038575
    Abstract: A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t?r?35t where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 ?m to 30 ?m and larger than that of the second curved surface.
    Type: Application
    Filed: August 18, 2005
    Publication date: February 23, 2006
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miri
  • Publication number: 20050189955
    Abstract: A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t?r?35t, where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 ?m to 30 ?m and larger than that of the second curved surface.
    Type: Application
    Filed: August 22, 2003
    Publication date: September 1, 2005
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki
  • Patent number: 6888344
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: ?=cos?1(1?t/R)?15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is ?, the probe have a flat portion at an end of the tip portion.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: May 3, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba
  • Patent number: 6885204
    Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: April 26, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yuetsu Watanabe
  • Patent number: 6741086
    Abstract: The present invention provides a member for removing foreign matter adhering to the spherical tip portion of a test probe which is put into contact with the bonding pads of a semiconductor chip to test the action of the semiconductor chip. The member includes four essential layers of a base plate, a first elastic member on the base plate and flexibly deformable upon contact of the probe, specifically, a predetermined Young's modulus, a second elastic member on the first elastic member and having a tensile strength and a thickness responding to contact stress produced by the contact of the probe, and an abrasive layer on the second elastic member and made of hard particles and a binding material in a volume ratio providing a smooth sliding action of the probe and producing a high abrasive efficiency to any adhering foreign matter. The removing member can smoothly slide the probe to effectively remove the foreign matter adhering to the probe tip.
    Type: Grant
    Filed: April 22, 2002
    Date of Patent: May 25, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeki Maekawa, Megumi Takemoto, Yoshihiro Kashiba
  • Publication number: 20040046580
    Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.
    Type: Application
    Filed: August 28, 2003
    Publication date: March 11, 2004
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yuetsu Watanabe
  • Patent number: 6667626
    Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: December 23, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yuetsu Watanabe
  • Patent number: 6646455
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: &thgr;=cos−1(1−t/R)≧15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is &thgr;, the probe have a flat portion at an end of the tip portion.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: November 11, 2003
    Assignee: Mitsubishi Denki Kabsuhiki Kaisha
    Inventors: Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba
  • Patent number: 6633176
    Abstract: A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 8t≦r≦23t, where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 &mgr;m to 30 &mgr;m and larger than that of the second curved surface.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: October 14, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki
  • Patent number: 6628127
    Abstract: A probe card 8 for testing a semiconductor integrated circuit is provided with a plurality of probes for inputting/outputting an electric signal for verifying the operation of a semiconductor integrated circuit 6 to/from bonding pads 7 of the semiconductor integrated circuit. The probes 9 are formed by depositing a conductive film 11 on a surface of a plurality of convex portions formed on a surface of an insulating substrate 10.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: September 30, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Masahiro Tanaka
  • Publication number: 20030160624
    Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.
    Type: Application
    Filed: February 25, 2002
    Publication date: August 28, 2003
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yuetsu Watanabe
  • Publication number: 20030090280
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of:
    Type: Application
    Filed: November 1, 2002
    Publication date: May 15, 2003
    Inventors: Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba
  • Publication number: 20020190737
    Abstract: The present invention provides a member for removing foreign matters adhering to the spherical tip portion of a test probe which is put into contact with the bonding pads of a semiconductor chip to test the action of the semiconductor chip. The member includes four essential layers of a base plate, the first elastic member formed on the base plates and having a material property of flexible deformation by the contact of the probe, specifically, a predetermined Young's modulus, the second elastic member formed on the first elastic member and having a tensile strength and a film thickness capable of responding to a contact stress produced by the contact of the probe, and an abrasive layer formed on the second elastic member and made of hard particles and a binding material which are mixed at a predetermined volume ratio to realize a smooth sliding action of the probe and producing a high abrasive efficiency of the foreign adhering matters.
    Type: Application
    Filed: April 22, 2002
    Publication date: December 19, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Shigeki Maekawa, Megumi Takemoto, Yoshihiro Kashiba
  • Publication number: 20020097060
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of:
    Type: Application
    Filed: July 24, 1998
    Publication date: July 25, 2002
    Inventors: SHIGEKI MAEKAWA, MEGUMI TAKEMOTO, KAZUNOBU MIKI, MUTSUMI KANO, TAKAHIRO NAGATA, YOSHIHIRO KASHIBA
  • Publication number: 20010046715
    Abstract: A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t≦r≦35t, where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 &mgr;m to 30 &mgr;m and larger than that of the second curved surface.
    Type: Application
    Filed: March 19, 2001
    Publication date: November 29, 2001
    Inventors: Megumi Takemoto, Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki