Patents by Inventor Megumu Doi

Megumu Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11286210
    Abstract: A joined material and a method of manufacturing the joined material are provided which enable a metal layer and a carbon material layer to be easily joined to each other while making the thickness of the metal layer larger and which can inhibit failure. A joined material includes a CFC layer (3) and a tungsten layer (4) that are joined to each other. A sintered tungsten carbide layer (5), a mixed layer (6) of SiC and WC, and SiC and WC (7) that have been sintered while intruding into the CFC layer (3), are formed between the CFC layer (3) and the tungsten layer (4), and these layers (3, 4, 5, 6, and 7) are joined to each other by sintering.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: March 29, 2022
    Assignee: TOYO TANSO CO., LTD.
    Inventors: Yoshinari Miyamoto, Ichiro Fujita, Megumu Doi, Taihei Matsumoto, Tomoyuki Okuni, Fumishige Nakamura, Weiwu Chen
  • Publication number: 20150344374
    Abstract: A joined material and a method of manufacturing the joined material are provided which enable a metal layer and a carbon material layer to be easily joined to each other while making the thickness of the metal layer larger and which can inhibit failure. A joined material includes a CFC layer (3) and a tungsten layer (4) that are joined to each other. A sintered tungsten carbide layer (5), a mixed layer (6) of SiC and WC, and SiC and WC (7) that have been sintered while intruding into the CFC layer (3), are formed between the CFC layer (3) and the tungsten layer (4), and these layers (3, 4, 5, 6, and 7) are joined to each other by sintering.
    Type: Application
    Filed: January 30, 2014
    Publication date: December 3, 2015
    Applicant: TOYO TANSO CO., LTD.
    Inventors: Yoshinari Miyamoto, Ichiro Fujita, Megumu Doi, Taihei Matsumoto, Tomoyuki Okuni, Fumishige Nakamura, Weiwu Chen
  • Patent number: 8894962
    Abstract: A carbon material and a method of manufacturing the carbon material are provided that can improve hardness and physical properties while fully gaining the benefit of SPS method, which makes it possible to obtain a dense carbon material with very short time. The carbon material is manufactured by a first step of filling mixture powder containing a carbon aggregate and a binder in a mold, and a second step of sintering the mixture powder by a spark plasma sintering method while compressing the mixture powder. The carbon material is characterized by having a Shore hardness HSD value of 60 or greater, and having a thermal expansion anisotropy ratio, an electrical resistivity anisotropy ratio, or a thermal conductivity anisotropy ratio, of 1.5 or greater.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: November 25, 2014
    Assignee: Toyo Tanso Co., Ltd.
    Inventors: Megumu Doi, Tsuyoshi Matsumoto, Yoshinari Miyamoto, Masao Tokita
  • Publication number: 20120237437
    Abstract: A carbon material and a method of manufacturing the carbon material are provided that can improve hardness and physical properties while fully gaining the benefit of SPS method, which makes it possible to obtain a dense carbon material with very short time. The carbon material is manufactured by a first step of filling mixture powder containing a carbon aggregate and a binder in a mold, and a second step of sintering the mixture powder by a spark plasma sintering method while compressing the mixture powder. The carbon material is characterized by having a Shore hardness HSD value of 60 or greater, and having a thermal expansion anisotropy ratio, an electrical resistivity anisotropy ratio, or a thermal conductivity anisotropy ratio, of 1.5 or greater.
    Type: Application
    Filed: October 13, 2010
    Publication date: September 20, 2012
    Applicant: TOYO TANSO CO., LTD.
    Inventors: Megumu Doi, Tsuyoshi Matsumoto, Yoshinari Miyamoto, Masao Tokita