Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the printed circuit board, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a temporary bulkhead that is movable between a deployed position and a stowed position, wherein in the deployed position, the temporary bulkhead is connected to the PCB and extends across the server in a path of the airflow, and wherein in the stowed position, the temporary bulkhead is disconnected from the PCB and is positioned to open the path of the airflow.

Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.

Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the printed circuit board, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a temporary bulkhead that is movable between a deployed position and a stowed position, wherein in the deployed position, the temporary bulkhead is connected to the PCB and extends across the server in a path of the airflow, and wherein in the stowed position, the temporary bulkhead is disconnected from the PCB and is positioned to open the path of the airflow.

Abstract: Embodiments relate to materials and methods for manufacturing the materials for an enclosure that houses one or more electronic devices. In some embodiments, the materials include a tuned micro-lattice that includes one or more metallic materials defining a micro-lattice configuration. In some embodiments, the one or more metallic materials extend over at least a portion of an elastomeric material. In some embodiments, the materials include a tuned composite metallic foam including one or more metallic materials. A first portion of the foam has a first porosity and a second portion of the foam has a second porosity. In some embodiments, the materials for the enclosure are one or more of a gasket and a coating that extends over a least a portion of an interior portion of the enclosure.