Patents by Inventor MEHDI HEJAZI DEHAGHANI

MEHDI HEJAZI DEHAGHANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally-conductive material layer and internal structure for ultrasound imaging
    Patent number: 11717271
    Abstract: An ultrasound imaging probe including a handle configured for handheld use; a support structure disposed within the handle and comprising a thermally-conductive material, the support structure further comprising a coupling surface and an external surface, the coupling surface disposed at a distal portion of the support structure; a continuous material layer coupled to the support structure, such that the continuous material layer is disposed on the coupling surface and the external surface, the continuous material layer thereby providing a heat transmission path between the coupling surface and the external surface; and an ultrasound sensor coupled to the support structure at the coupling surface and directly in contact with the continuous material layer at the coupling surface, such that heat from the ultrasound sensor is transmitted away to the support structure via the heat transmission path of the continuous material layer.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: August 8, 2023
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Junho Song, Edward Chan, Steven Michael Tavoletti, Mehdi Hejazi Dehaghani
  • THERMALLY-CONDUCTIVE MATERIAL LAYER AND INTERNAL STRUCTURE FOR ULTRASOUND IMAGING
    Publication number: 20210059645
    Abstract: An ultrasound imaging probe including a handle configured for handheld use; a support structure disposed within the handle and comprising a thermally-conductive material, the support structure further comprising a coupling surface and an external surface, the coupling surface disposed at a distal portion of the support structure; a continuous material layer coupled to the support structure, such that the continuous material layer is disposed on the coupling surface and the external surface, the continuous material layer thereby providing a heat transmission path between the coupling surface and the external surface; and an ultrasound sensor coupled to the support structure at the coupling surface and directly in contact with the continuous material layer at the coupling surface, such that heat from the ultrasound sensor is transmitted away to the support structure via the heat transmission path of the continuous material layer.
    Type: Application
    Filed: March 22, 2019
    Publication date: March 4, 2021
    Inventors: JUNHO SONG, EDWARD CHAN, STEVEN MICHAEL TAVOLETTI, MEHDI HEJAZI DEHAGHANI