Patents by Inventor Mehdi Mohamed Mechaik

Mehdi Mohamed Mechaik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing printed circuit boards with routing conductors and dielectric strands
    Patent number: 11596054
    Abstract: Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer includes a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor have a matching orientation and separation distance from a source to a destination.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: February 28, 2023
    Assignee: International Business Machines Corporation
    Inventors: Yanyan Zhang, Lloyd Andre Walls, Jinwoo Choi, Mehdi Mohamed Mechaik
  • Printed Circuit Board with Routing of a Conductor and Dielectric Strands
    Publication number: 20200092980
    Abstract: Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer is comprised of a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor having a matching orientation and separation distance from a source to a destination.
    Type: Application
    Filed: October 31, 2019
    Publication date: March 19, 2020
    Applicant: International Business Machines Corporation
    Inventors: Yanyan Zhang, Lloyd Andre Walls, Jinwoo Choi, Mehdi Mohamed Mechaik
  • Printed circuit board with routing of a conductor and dielectric strands
    Patent number: 10542618
    Abstract: Embodiments are directed to a printed circuit board and a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material, an intermediate layer positioned adjacent to the dielectric material, and a conductor positioned adjacent to the intermediate layer. The intermediate layer is comprised of fiberglass strands having an associated orientation. When assembled, the fiberglass of the intermediate layer and the conductor having a matching orientation and separation distance from a source to a destination.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: January 21, 2020
    Assignee: International Business Machines Corporation
    Inventors: Yanyan Zhang, Lloyd Andre Walls, Jinwoo Choi, Mehdi Mohamed Mechaik