Abstract: An adapter and method for through the lens (TTL) laser range sensor probes enables use of a TTL probe of a given exit pupil size to be used with a shared objective lens requiring a entrance pupil size, as entered from the laser range sensor, that is different from the TTL probe exit pupil size. Embodiments of the adapter include optics, such as a first lens and a resolving second lens that expand or contract the TTL laser radiation depending on whether the first lens is a diverging, a negative focal length lens, or a converging, positive focal length lens, and the second lens is converging or diverging, respectively, in a Galilean arrangement. Embodiments also provide a Keplerian arrangement, can function with non-collimated radiation, and can include mirrors to yield a more compact adapter. Additional embodiments include at least one adjustable lens element between the first and second lenses, the at least one adjustable lens element being connected to an actuator for movement along the optical path.

Abstract: Laser beam scanners having a polarization sensitive beam deflecting surface (specifically a monofacet nondisc plane diffraction grating (NPDG) monofacet deflector and a dual reflection monofacet polarization sensitive deflector that incorporates a polarizing beam splitter cube) achieve essentially 100% radiometric throughput efficiency while also achieving a scan beam intensity that stays constant over the total range of scan angles by using a circularly polarized incident beam and a quarter-wave retardation plate at the entrance aperture of the scanner assembly so that the quarter-wave plate rotates with the assembly. The quarter-wave plate has its optical axis oriented with respect to the incident beam so that it converts the incident circularly polarized beam into a linearly polarized beam having a polarization direction that maximizes the radiometric throughput efficiency of the scanner assembly.

Abstract: A hologon scanning system which provides two sequential scans across an image plane per revolution of the hologon. The hologon is a disc having a single facet with a planar linear diffraction grating in a surface which is perpendicular to the axis of rotation of the disc and which is centered on the axis of rotation. An incident laser beam which preferably overfills the facet is diffracted and scanned by the rotation of the facet. The facet is preferably elliptical in shape with its major axis perpendicular to the facet grating lines. The diameter of the disc can be made only slightly larger than the profile of the incident beam on the disc so as to minimize inertia and enable the disc to be rotated at very high speeds without failure due to centrifugal force induced stress. Four sequential scans per revolution can be produced by using a pair of superimposed centered facets with their grating lines oriented orthogonally to each other.

Abstract: An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.

Abstract: An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.

Abstract: An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.

Abstract: Apparatus and method of fabricating a sensor array from a (110) silicon substrate having a row of photosites to provides a sensor array chip with uniformly smooth and angled ends designed to permit the chip to be lock butted end to end with other like chips to form a full length scanning array in which the substrate is etched for separation along the (111) planes at the desired boundaries of the chip, the etched boundaries delimiting the chip ends running between selected pairs of photosites to provide whole photosites right up to the ends of the chip so as to avoid any cap or interruption between the photosites at the junctions with other chips.In a second embodiment, the chip ends are formed with complementary irregular shapes to enhance locating and butting of the chips with one another, and in a third embodiment, grooves are etched between each of the photosites in the row to assure photosite uniformity and prevent cross talk between photosites.

Abstract: Apparatus and method of fabricating a sensor array from a (110) silicon substrate having a row of photosites to provide a sensor array chip with uniformly smooth and angled ends designed to permit the chip to be lock butted end to end with other like chips to form a full length scanning array in which the substrate is etched for separation along the (111) planes at the desired boundaries of the chip, the etched boundaries delimiting the chip ends running between selected pairs of photosites to provide whole photosites right up to the ends of the chip so as to avoid any gap or interruption between the photosites at the junctions with other chips.In a second embodiment, the chip ends are formed with complementary irregular shapes to enhance locating and butting of the chips with one another, and in a third embodiment, grooves are etched between each of the photosites in the row to assure photosite uniformity and prevent cross talk between photosites.

Abstract: A raster output scanner having a recording member, a laser, a total internal reflection type modulator having an array of independently addressable electrodes, optical means cooperable with the laser to provide a sheetlike beam of high intensity radiation at the modulator, the array of electrodes being pulsed in succession with each image pixel to provide wave after wave of imaging or non-imaging beams, a scanning polygon for scanning the imaging beams from the modulator across the recording member line by line, and means for pulsing the modulator electrodes at a speed equal to the speed of the scanning polygon and in a direction opposite to the polygon scanning direction to obviate image blur.

Abstract: A sensor array for butting against other like arrays to form a full width array. The active surface of the array chip is first etched to form a V-shaped groove defining an array end; then a parallel groove is cut in the opposite inactive surface with a centerline parallel to but offset from the centerline of the V-shaped groove by an amount sufficient to allow extension of the wafer (111) crystalline plane from the V-shaped groove to the cut groove; then the water is supported in cantilever fashion along an edge substantially coplanar with the V-shaped groove and a downward force is applied to the wafer free end to cause the wafer to fracture along the (111) crystalline plane thereby cleaving the chip from the wafer and providing a uniformly smooth and straight array end for butting against the end of a like array.

Abstract: The method of fabricating Light Emitting Diodes (LEDs) with supporting circuits on a silicon chip or wafer for a Full Width Array (FWA) in which the silicon substrate or chip is first coated with Silicon Dioxide to form a thin film layer, a plurality of holes corresponding in number and configuration to the desired array are next opened in the layer, Gallium Phosphide LEDs together with p-n junctions and contact layers are then grown epitaxially in the holes, and finally attendant LED operating circuits are epitaxially formed on the silicon chip together with operative connections to the individual LEDs by Integrated Circuit techniques.

Abstract: An arrangement for optically creating a full width scanning array from a plurality of small scanning or writing arrays. The small arrays are disposed in alternating staggered relation in two parallel rows on a substrate with the array viewing fields overlapping to prevent discontinuity. The substrate bearing the arrays is placed in optical relation with an array of fiber optic lenses which transmit an image line to or from the arrays. A biprism array composed of plural prisms, one for each smaller array, is located between the substrate bearing the arrays and the lens array. To destagger the separated scanning arrays and produce a single uninterrupted full width scanning array, alternate ones of the prisms in the biprism array are reversed.

Abstract: A full width opto-mechanical modulator comprised of a silicon chip have dual rows or arrays of flexible finger-like reflectors disposed thereon in staggered facing relationship to one another. The reflectors, the surface of which is highly reflective, bend in response to the application of a predetermined potential. The modulator is placed in the path of a beam of high intensity light, and potentials applied to selected reflectors in accordance with an image signal input cause the modulator to reflect light striking the individual reflectors in either an exposure path or against a beam stop.

Abstract: A dual mode reproduction machine or copier incorporating a full width read/write bar having at least one linear array of flexible reflectors selectively bendable in response to the application of electrical potentials thereto, the reflectors reflecting imaging rays either onto an imaging member to expose the same or onto a beam stop in response to an image signal input. A second parallel array of photodetector elements permits a document original to be read line by line, and the document image converted to image signals. Light transmission arrays cooperate with the read/write bar to enable exposure of the imaging member or reading of a document original selectively.