Abstract: A device that includes a first integrated device, a second integrated device configured to be electrically coupled to the first integrated device and an electrowetting device configured to be electrically coupled to the second integrated device. The electrowetting device is configured to redistribute heat across a back surface of the device by looping a liquid in the electrowetting device, along the back surface of the device.

Abstract: A method includes: acquiring temperature values from a plurality of temperature sensors spatially distributed within a device; using the temperature values, calculating skin temperature values corresponding to each of the temperature sensors; comparing the skin temperature values to a first temperature threshold; in response to determining that at least one of the skin temperature values exceeds the first temperature threshold, measuring temperature over time; comparing the temperature over time to a second temperature threshold; and in response to determining that the temperature over time exceeds the second temperature threshold, reducing power consumption of the device.

Abstract: A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.

Abstract: Various embodiments of methods and systems context-aware thermal management in a portable computing device (“PCD”) are disclosed. Notably, the environmental context to which a PCD is subjected may have significant impact on the PCD's thermal energy dissipation efficiency. Embodiments of the solution seek to leverage knowledge of a PCD's environmental context to modify or adjust thermal policy parameters applied within a PCD in response to a thermal event within the PCD.

Abstract: A method for temperature mitigation includes receiving a signal from a temperature sensor that is disposed within a computing device. A processor chip within the computing device produces heat. The signal from the temperature sensor is converted to temperature data. The method further includes processing the temperature data to generate an estimate of a temperature of an external surface of the device. The processing includes applying a low pass filter to the temperature data, applying an amplitude attenuation to the temperature data, and applying a delay to the temperature data. The method further includes reducing an operating parameter of the processor chip, such as operating frequency, in response to the estimated temperature of the external surface of the device.

Abstract: In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.

Abstract: A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.

Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

Abstract: Aspects of the disclosure are directed to a package including a substrate, die coupled to the substrate, wick deposited on the die, and an evaporation-condensation chamber having a hollowed bottom and two bottom lips, wherein the wick mates into the hollowed enclosure and substantially merges with the two bottom lips forming a sealed chamber. Other aspects are directed to a method of forming a package including coupling a die to a substrate, depositing a wick on the die, and mating the wick with an evaporation-condensation chamber having a hollowed enclosure and two bottom lips, wherein the mating attaches the wick into the hollowed enclosure and substantially merges the wick with the two bottom lips forming a sealed chamber. By directly depositing the wick over the die and integrating the wick with the encapsulation-condensation chamber, this integrated solution provides significant improvement in package thermal resistance especially for high-power and high-performance applications.

Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.

Abstract: A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.

Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

Abstract: An integrated device that includes a substrate, a device level layer formed over the substrate, and interconnect portion over the device level layer. The device level layer includes a plurality of first device level cells, each first device level cell comprising a first configuration. The device level layer includes a plurality of second device level cells. At least one second device level cell includes a second configuration that is different than the first configuration. The plurality of second device level cells is located over at least one region of the integrated device comprising at least one hotspot.

Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.

Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

Abstract: Various embodiments of methods and systems context-aware thermal management in a portable computing device (“PCD”) are disclosed. Notably, the environmental context to which a PCD is subjected may have significant impact on the PCD's thermal energy dissipation efficiency. Embodiments of the solution seek to leverage knowledge of a PCD's environmental context to modify or adjust thermal policy parameters applied within a PCD in response to a thermal event within the PCD.

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.

Abstract: A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.

Abstract: A system includes a computer processor including N cores; and a plurality of device aging sensors, wherein each one of the plurality of device aging sensors is disposed within a respective core, the plurality of device aging sensors being configured to communicate core aging information with a core scheduler in the computer processor, wherein the core scheduler is configured to make a first set of M cores available to a thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a first time period in which the core aging information indicates that aging of the first set of M cores is below a threshold, and wherein the core scheduler is configured to make a second set of M cores available to the thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a second time period.