Patents by Inventor Mehradad Ziari

Mehradad Ziari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060140574
    Abstract: Cleaved grooves, also referred to herein as “cleave streets”, are formed exclusively in a wafer passivation layer overlaying a wafer to provide for correctly aligned and sharp cleaves prior to singulation of the wafer into separate die or chips.
    Type: Application
    Filed: February 27, 2006
    Publication date: June 29, 2006
    Applicant: Infinera Corporation
    Inventors: Charles Joyner, Mark Missey, Radhakrishnan Nagarajan, Frank Peters, Mehradad Ziari, Fred Kish