Patents by Inventor Mehran Maalekian

Mehran Maalekian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free high reliability solder alloys
    Patent number: 10195698
    Abstract: A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: February 5, 2019
    Assignee: AIM Metals & Alloys Inc.
    Inventors: Mehran Maalekian, Karl Seelig
  • LEAD-FREE HIGH RELIABILITY SOLDER ALLOYS
    Publication number: 20170066089
    Abstract: A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 9, 2017
    Applicant: AIM Metals & Alloys Inc.
    Inventors: Mehran Maalekian, Karl Seelig