Patents by Inventor Mehran Pour Mousavi

Mehran Pour Mousavi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias
    Patent number: 9337522
    Abstract: According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: May 10, 2016
    Assignee: Infineon Technologies AG
    Inventors: Saverio Trotta, Jagjit Singh Bal, Maciej Wojnowski, Ernst Seler, Mehran Pour Mousavi
  • System and Method for a Millimeter Wave Circuit Board
    Publication number: 20150117862
    Abstract: According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.
    Type: Application
    Filed: October 30, 2013
    Publication date: April 30, 2015
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Jagjit Singh Bal, Maciej Wojnowski, Ernst Seler, Mehran Pour Mousavi
  • Semiconductor packages with integrated antenna and method of forming thereof
    Patent number: 8952521
    Abstract: In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: February 10, 2015
    Assignee: Infineon Technologies AG
    Inventors: Maciej Wojnowski, Walter Hartner, Ottmar Geitner, Gottfried Beer, Klaus Pressel, Mehran Pour Mousavi
  • Semiconductor packages with integrated antenna and methods of forming thereof
    Patent number: 8866292
    Abstract: In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: October 21, 2014
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Maciej Wojnowski, Mehran Pour Mousavi
  • Semiconductor Packages with Integrated Antenna and Method of Forming Thereof
    Publication number: 20140110840
    Abstract: In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.
    Type: Application
    Filed: January 8, 2013
    Publication date: April 24, 2014
    Applicant: Infineon Technologies AG
    Inventors: Maciej Wojnowski, Walter Hartner, Ottmar Geitner, Gottfried Beer, Klaus Pressel, Mehran Pour Mousavi
  • Semiconductor Packages with Integrated Antenna and Methods of Forming Thereof
    Publication number: 20140110841
    Abstract: In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.
    Type: Application
    Filed: January 8, 2013
    Publication date: April 24, 2014
    Applicant: Infineon Technologies AG
    Inventors: Gottfried Beer, Maciej Wojnowski, Mehran Pour Mousavi