Abstract: A MEMS resonant accelerometer includes two proof masses configured to resonate when driven with periodic signals. Each proof mass includes a resonator structure that vibrates relative to the proof mass and a dummy structure that does not resonate. When driven by a periodic drive signal, the resonator structures of the two proof masses may be used to determine the magnitude of acceleration in the direction perpendicular to the planes of the proof masses by sensing the frequency at which the resonators vibrate. For example, a differential oscillation frequency may be computed from the two sensed frequencies. The dummy structures are used to make the mass distribution of the two proof masses similar.

Abstract: Multiple-axis resonant accelerometers are based on detection of resonance frequency changes of one or more electrostatically-driven resonator masses due to electrostatic gap changes under acceleration. Specifically, one or more resonator masses are configured to resonate simultaneously in different directions associated with different axes of sensitivity (e.g., X, Y, and/or Z axes). The motion of each resonator mass is monitored through one or more electrostatically-coupled sense electrodes. An acceleration along a particular axis of sensitivity causes a small change in the electrostatic gap(s) between the corresponding resonator mass(es) and the sense electrode(s) associated with that axis of sensitivity, and this electrostatic gap change manifests as a small change in the resonance frequency of the resonator from which an accelerometer output signal can be produced.

Abstract: Various embodiments mitigate the risk of frequency-lock in systems having multiple resonators by dynamically changing the frequency at which at least one of the resonators is driven. More particularly, the drive frequency of at least one of the resonators is changed often enough that the multiple resonators do not have time to achieve frequency lock. Changes in the oscillation of the resonators may be analyzed to determine, for example, acceleration of such systems. Some embodiments implement self-test by assessing expected performance of a system with toggling drive frequencies. More particularly, some embodiments implement self-test by artificially inducing displacement of a movable member of a system.

Abstract: A MEMS resonant accelerometer includes two proof masses configured to resonate when driven with periodic signals. Each proof mass includes a resonator structure that vibrates relative to the proof mass and a dummy structure that does not resonate. When driven by a periodic drive signal, the resonator structures of the two proof masses may be used to determine the magnitude of acceleration in the direction perpendicular to the planes of the proof masses by sensing the frequency at which the resonators vibrate. For example, a differential oscillation frequency may be computed from the two sensed frequencies. The dummy structures are used to make the mass distribution of the two proof masses similar.

Abstract: Various embodiments mitigate the risk of frequency-lock in systems having multiple resonators by dynamically changing the frequency at which at least one of the resonators is driven. More particularly, the drive frequency of at least one of the resonators is changed often enough that the multiple resonators do not have time to achieve frequency lock. Changes in the oscillation of the resonators may be analyzed to determine, for example, acceleration of such systems. Some embodiments implement self-test by assessing expected performance of a system with toggling drive frequencies. More particularly, some embodiments implement self-test by artificially inducing displacement of a movable member of a system.

Abstract: A MEMS resonant accelerometer is described. The MEMS resonant accelerometer may comprise a pair of proof masses configured to resonate when driven with periodic signals. In this respect, the accelerometer's proof masses may serve as masses for detecting accelerations as well as resonators. The MEMS resonant accelerometer may comprise drive electrodes for causing the proof masses to resonate and sense electrodes for sensing motion of the proof masses. The magnitude of a z-axis acceleration, that is, an acceleration perpendicular to the plane of the proof masses, may be detected by sensing the frequency at which the proof masses resonate in the presence of such an acceleration. The proof masses may be arranged to produce differential signals.

Abstract: Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

Abstract: Various embodiments mitigate the risk of frequency-lock in systems having multiple resonators by dynamically changing the frequency at which at least one of the resonators is driven. More particularly, the drive frequency of at least one of the resonators is changed often enough that the multiple resonators do not have time to achieve frequency lock. Changes in the oscillation of the resonators may be analyzed to determine, for example, acceleration of such systems. Some embodiments implement self-test by assessing expected performance of a system with toggling drive frequencies. More particularly, some embodiments implement self-test by artificially inducing displacement of a movable member of a system.

Abstract: Multiple-axis resonant accelerometers are based on detection of resonance frequency changes of one or more electrostatically-driven resonator masses due to electrostatic gap changes under acceleration. Specifically, one or more resonator masses are configured to resonate simultaneously in different directions associated with different axes of sensitivity (e.g., X, Y, and/or Z axes). The motion of each resonator mass is monitored through one or more electrostatically-coupled sense electrodes. An acceleration along a particular axis of sensitivity causes a small change in the electrostatic gap(s) between the corresponding resonator mass(es) and the sense electrode(s) associated with that axis of sensitivity, and this electrostatic gap change manifests as a small change in the resonance frequency of the resonator from which an accelerometer output signal can be produced.

Abstract: Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

Abstract: An apparatus includes a microelectromechanical system (MEMS) device. The MEMS device includes a resonator suspended from a substrate, an anchor disposed at a center of the resonator, a plurality of suspended beams radiating between the anchor and the resonator, a plurality of first electrodes disposed about the anchor, and a plurality of second electrodes disposed about the anchor. The plurality of first electrodes and the resonator form a first electrostatic transducer. The plurality of second electrodes and the resonator form a second electrostatic transducer. The first electrostatic transducer and the second electrostatic transducer are configured to sustain rotational vibrations of the resonator at a predetermined frequency about an axis through the center of the resonator and orthogonal to a plane of the substrate in response to a signal on the first electrode.

Abstract: Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

Abstract: Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

Abstract: An apparatus includes a microelectromechanical system (MEMS) device. The MEMS device includes a resonator suspended from a substrate, an anchor disposed at a center of the resonator, a plurality of suspended beams radiating between the anchor and the resonator, a plurality of first electrodes disposed about the anchor, and a plurality of second electrodes disposed about the anchor. The plurality of first electrodes and the resonator form a first electrostatic transducer. The plurality of second electrodes and the resonator form a second electrostatic transducer. The first electrostatic transducer and the second electrostatic transducer are configured to sustain rotational vibrations of the resonator at a predetermined frequency about an axis through the center of the resonator and orthogonal to a plane of the substrate in response to a signal on the first electrode.

Abstract: A microelectromechanical system (MEMS) device includes a resonator anchored to a substrate. The resonator includes a first strain gradient statically deflecting a released portion of the resonator in an out-of-plane direction with respect to the substrate. The resonator includes a first electrode anchored to the substrate. The first electrode includes a second strain gradient of a released portion of the first electrode. The first electrode is configured to electrostatically drive the resonator in a first mode that varies a relative amount of displacement between the resonator and the first electrode. The resonator may include a resonator anchor anchored to the substrate. The first electrode may include an electrode anchor anchored to the substrate in close proximity to the resonator anchor. The electrode anchor may be positioned relative to the resonator anchor to substantially decouple dynamic displacements of the resonator relative to the electrode from changes to the substrate.

Abstract: A method of forming a microelectromechanical systems (MEMS) device includes forming an electrode on a substrate. The method includes forming a structural layer on the substrate. The structural layer is disposed about a perimeter of the electrode and has a residual film stress gradient. The method includes releasing the structural layer to form a resonator coupled to the substrate. The residual film stress gradient deflects a first portion of the resonator out of a plane defined by a surface of the electrode.

Abstract: A MEMS oscillator includes a resonator body and primary and secondary drive electrodes to electrostatically drive the resonator body. Primary and secondary sense electrodes sense motion of the resonator body. The primary and secondary drive and sense electrodes are configured to be used together during start-up of the MEMS oscillator. The secondary drive electrode and secondary sense electrode are disabled after start-up, while the primary drive and sense electrodes remain enabled to maintain oscillation.

Abstract: A MEMS oscillator includes a resonator body and primary and secondary drive electrodes to electrostatically drive the resonator body. Primary and secondary sense electrodes sense motion of the resonator body. The primary and secondary drive and sense electrodes are configured to be used together during start-up of the MEMS oscillator. The secondary drive electrode and secondary sense electrode are disabled after start-up, while the primary drive and sense electrodes remain enabled to maintain oscillation.

Abstract: A microelectromechanical system (MEMS) device includes a resonator anchored to a substrate. The resonator includes a first strain gradient statically deflecting a released portion of the resonator in an out-of-plane direction with respect to the substrate. The resonator includes a first electrode anchored to the substrate. The first electrode includes a second strain gradient of a released portion of the first electrode. The first electrode is configured to electrostatically drive the resonator in a first mode that varies a relative amount of displacement between the resonator and the first electrode. The resonator may include a resonator anchor anchored to the substrate. The first electrode may include an electrode anchor anchored to the substrate in close proximity to the resonator anchor. The electrode anchor may be positioned relative to the resonator anchor to substantially decouple dynamic displacements of the resonator relative to the electrode from changes to the substrate.

Abstract: A method of forming a microelectromechanical systems (MEMS) device includes forming an electrode on a substrate. The method includes forming a structural layer on the substrate. The structural layer is disposed about a perimeter of the electrode and has a residual film stress gradient. The method includes releasing the structural layer to form a resonator coupled to the substrate. The residual film stress gradient deflects a first portion of the resonator out of a plane defined by a surface of the electrode.