Patents by Inventor Mehrnaz Rouhi Youssefi

Mehrnaz Rouhi Youssefi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SLOTTED MEMS FORCE SENSOR
    Publication number: 20230296454
    Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 21, 2023
    Inventors: Mehrnaz Rouhi Youssefi, Julius Minglin Tsai
  • Slotted MEMS force sensor
    Patent number: 11698310
    Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: July 11, 2023
    Assignee: NextInput, Inc.
    Inventors: Mehrnaz Rouhi Youssefi, Julius Minglin Tsai
  • SLOTTED MEMS FORCE SENSOR
    Publication number: 20210285832
    Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
    Type: Application
    Filed: March 29, 2021
    Publication date: September 16, 2021
    Inventors: Mehrnaz Rouhi Youssefi, Julius Minglin Tsai