Patents by Inventor Mei Cheng Liu

Mei Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic substrate and electronic device
    Patent number: 12362300
    Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.
    Type: Grant
    Filed: October 19, 2023
    Date of Patent: July 15, 2025
    Assignee: Innolux Corporation
    Inventors: Chueh Yuan Nien, Chao-Chin Sung, Chia-Hung Hsieh, Mei Cheng Liu
  • ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
    Publication number: 20240047393
    Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 8, 2024
    Applicant: Innolux Corporation
    Inventors: Chueh Yuan Nien, Chao-Chin Sung, Chia-Hung Hsieh, Mei Cheng Liu
  • Electronic substrate and electronic device
    Patent number: 11830833
    Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: November 28, 2023
    Assignee: Innolux Corporation
    Inventors: Chueh Yuan Nien, Chao-Chin Sung, Chia-Hung Hsieh, Mei Cheng Liu
  • ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
    Publication number: 20220028809
    Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 27, 2022
    Applicant: Innolux Corporation
    Inventors: Chueh Yuan Nien, Chao-Chin Sung, Chia-Hung Hsieh, Mei Cheng Liu