Abstract: A casing structure including a first housing, a glue layer, and a second housing is provided. The first housing has a first inner edge. The glue layer is disposed at the first inner edge. The second housing has a second inner edge. The first housing is assembled to the second housing, and the first inner edge is aligned with the second inner edge. The glue layer abuts against the second inner edge so as to combine the first housing with the second housing. A gap formed between the glue layer and a part of the second inner edge is defined as a glue overflow buffer area.

Abstract: An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap.

Abstract: An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap.

Abstract: A casing structure including a first housing, a glue layer, and a second housing is provided. The first housing has a first inner edge. The glue layer is disposed at the first inner edge. The second housing has a second inner edge. The first housing is assembled to the second housing, and the first inner edge is aligned with the second inner edge. The glue layer abuts against the second inner edge so as to combine the first housing with the second housing. A gap formed between the glue layer and a part of the second inner edge is defined as a glue overflow buffer area.

Abstract: An electronic device includes a body, an electronic module, and an elastic element, wherein the body has at least an accommodating space and a first connector. The electronic module is accommodated in the accommodating space and has a plurality of connection ports and a second connector electrically connected to the plurality of connection ports. The second connector is electrically connected to the first connector, and the plurality of connection ports is exposed on the outer surface of the body. The elastic element surrounds the junction between the first connector and the second connector, wherein the electronic module presses the elastic element against the body.

Abstract: An electronic device includes a body, an electronic module, and an elastic element, wherein the body has at least an accommodating space and a first connector. The electronic module is accommodated in the accommodating space and has a plurality of connection ports and a second connector electrically connected to the plurality of connection ports. The second connector is electrically connected to the first connector, and the plurality of connection ports is exposed on the outer surface of the body. The elastic element surrounds the junction between the first connector and the second connector, wherein the electronic module presses the elastic element against the body.