Patents by Inventor Mei Jan Chu

Mei Jan Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally Formed Three-Dimensional Mesh Fabric
    Publication number: 20110244170
    Abstract: A thermally formed three-dimensional mesh fabric comprises a flexible three dimensional permeable sheet and a thermally formed cover. The flexible three dimensional permeable sheet has a surface and a softening temperature. The thermally formed cover is applied to at least a portion of the surface of the three dimensional permeable sheet, is low-temperature thermoplastic polyester and has a softening temperature lower than that of the three dimensional permeable sheet. Thus, thermal forming three-dimensional mesh fabric is permeable, lightweight and has good support and is suitable for applications such as splints, plaster bandages and safety protectors.
    Type: Application
    Filed: April 2, 2010
    Publication date: October 6, 2011
    Inventors: Sun Fu Hsu, Mei Jan Chu, Kuo Hsiung Wang, Yi-Che Huang, Qi-Wen Lu, Chien-Cheng Lin