Patents by Inventor Mei-Jun WANG

Mei-Jun WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electric connection and method of manufacturing the same
    Patent number: 10213986
    Abstract: An electric connection is provided, and has a first copper (Cu) layer, a second Cu layer, and a composite metal layer disposed between the first Cu layer and the second Cu layer. The composite metal layer has 0.01 wt. %?gallium (Ga)?20 wt. %, 0.01 wt. %?copper (Cu)?50 wt. %, and 30 wt. %?nickel (Ni)?99.98 wt. %. Moreover, a method of manufacturing the electric connection is provided, and has the steps of: (1) providing a first Cu layer and a second Cu layer; (2) forming a first Ni layer on the first Cu layer; (3) forming a second Ni layer on the second Cu layer; (4) forming a Ga layer on the first Ni layer; and (5) keeping the second Ni layer in contact with the Ga layer and carrying out a thermo-compress bonding therebetween to form the electric connection.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: February 26, 2019
    Assignee: National Cheng Kung University
    Inventors: Shih-Kang Lin, Hao-Miao Chang, Mei-Jun Wang, Cheng-Liang Cho, Che-Yu Yeh
  • ELECTRIC CONNECTION AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160121582
    Abstract: An electric connection is provided, and has a first copper (Cu) layer, a second Cu layer, and a composite metal layer disposed between the first Cu layer and the second Cu layer. The composite metal layer has 0.01 wt. %?gallium (Ga)?20 wt. %, 0.01 wt. %?copper (Cu)?50 wt. %, and 30 wt. %?nickel (Ni)?99.98 wt. %. Moreover, a method of manufacturing the electric connection is provided, and has the steps of: (1) providing a first Cu layer and a second Cu layer; (2) forming a first Ni layer on the first Cu layer; (3) forming a second Ni layer on the second Cu layer; (4) forming a Ga layer on the first Ni layer; and (5) keeping the second Ni layer in contact with the Ga layer and carrying out a thermo-compress bonding therebetween to form the electric connection.
    Type: Application
    Filed: November 3, 2015
    Publication date: May 5, 2016
    Inventors: Shih-Kang LlN, Hao-Miao CHANG, Mei-Jun WANG, Cheng-Liang CHO, Che-Yu YEH