Abstract: A structure of light-emitting diode includes a base, a circuit board, at least one light emission chip, a light-transmitting resin layer, and a light adjustment film. The base forms a cavity. The circuit board is mounted at a bottom of the cavity. The light emission chip is electrically connected to the circuit board. The light-transmitting resin layer is received in the cavity and bonded to the circuit board to encapsulate the light emission chip. The light adjustment film is separately provided and is set on a top of the light-transmitting resin layer and contains therein uniformly distributed powders of phosphor to allow the light-emitting diode to project uniform light.

Abstract: A light emitting diode (LED) device applied to a backlight module includes a substrate, a plurality of sub-substrates, a plurality of light emitting chips, and a plurality of package lenses. The sub-substrates are installed on the substrate, and the light emitting chips are installed on the sub-substrates respectively. The package lenses are installed on the light emitting chips respectively, and each package lens is in a solid semi-elliptical shape and includes a long axis and a short axis perpendicular to the long axis.