Patents by Inventor Mei-Lin Chan

Mei-Lin Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210019488
    Abstract: An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation. During the imaging operation, the array controller is configured to control a transmission frequency of activated ultrasonic transducers during the imaging operation, wherein a plurality of transmission frequencies are used during the imaging operation to account for an impact of an interference pattern caused by the non-uniform thickness of the contact layer, and is configured to capture at least one fingerprint image using the plurality of transmission frequencies.
    Type: Application
    Filed: January 13, 2020
    Publication date: January 21, 2021
    Applicant: InvenSense, Inc.
    Inventors: Quy CHAU, Mei-Lin CHAN
  • Publication number: 20210019487
    Abstract: An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation for imaging a plurality of pixels at a plurality of positions within the two-dimensional array of ultrasonic transducers.
    Type: Application
    Filed: January 13, 2020
    Publication date: January 21, 2021
    Applicant: InvenSense, Inc.
    Inventors: Quy CHAU, Mei-Lin CHAN, Xiaoyue JIANG
  • Publication number: 20200401783
    Abstract: In a method for determining whether a finger is a real finger at an ultrasonic fingerprint sensor, a first image of a fingerprint pattern is captured at an ultrasonic fingerprint sensor, wherein the first image is based on ultrasonic signals corresponding to a first time of flight range. A second image of the fingerprint pattern is captured at the ultrasonic fingerprint sensor, wherein the second image is based on ultrasonic signals corresponding to a second time of flight range, the second time of flight range being delayed compared to the first time of flight range. A difference in a width of ridges of the fingerprint pattern in the first image compared to the width of ridges of the fingerprint pattern in the second image is quantified. Based on the quantification of the difference, a probability whether the finger is a real finger is determined.
    Type: Application
    Filed: June 23, 2020
    Publication date: December 24, 2020
    Applicant: InvenSense, Inc.
    Inventors: Sina AKHBARI, Lingtao WANG, Mei-Lin CHAN, Nikhil APTE
  • Publication number: 20200367858
    Abstract: An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a first piezoelectric layer having a first surface and a second surface, a second piezoelectric layer having a first surface and a second surface, wherein the second surface of the first piezoelectric layer faces the first surface of the second piezoelectric layer, a first electrode coupled to the first surface of the first piezoelectric layer, a second electrode coupled to the second surface of the second piezoelectric layer, and a third electrode between the first piezoelectric layer and the second piezoelectric layer.
    Type: Application
    Filed: May 20, 2020
    Publication date: November 26, 2020
    Applicant: InvenSense, Inc.
    Inventors: Leonardo BALDASARRE, Mei-Lin CHAN
  • Publication number: 20200134280
    Abstract: A fingerprint sensor is provided herein. A method for operating the fingerprint sensor can comprise selecting a pair of electrode elements from a first set of electrode elements and a second set of electrode elements of a second electrode. The first electrode is located on a first side of a piezoelectric layer; the second electrode is located on a second side of the piezoelectric layer. The first side and the second side are opposite sides of the piezoelectric layer. The method also can comprise transmitting ultrasonic signals using the pair of electrode elements based on a position of a switch element being in a first position, and receiving ultrasonic signals using the pair of electrode elements based on the position of the switch element being in a second position.
    Type: Application
    Filed: October 23, 2019
    Publication date: April 30, 2020
    Inventors: Nikhil Apte, Leonardo Baldasarre, Mei-Lin Chan, Ventsislav Yanchev
  • Publication number: 20200061670
    Abstract: An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 27, 2020
    Applicant: InvenSense, Inc.
    Inventors: Mei-Lin CHAN, Nikhil APTE, Renata Melamud BERGER
  • Publication number: 20190262865
    Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.
    Type: Application
    Filed: February 7, 2019
    Publication date: August 29, 2019
    Inventors: Emad Mehdizadeh, Bongsang Kim, Chienliu Chang, Leonardo Baldasarre, Nikhil Apte, Xiaoyue Jiang, Mei-Lin Chan
  • Publication number: 20190267536
    Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.
    Type: Application
    Filed: February 21, 2019
    Publication date: August 29, 2019
    Inventors: Nikhil Apte, Chienliu Chang, Shreyas Thakar, Mei-Lin Chan
  • Patent number: 9809451
    Abstract: A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: November 7, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Mei-Lin Chan, Xiang Li, Martin Lim
  • Patent number: 9802815
    Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: October 31, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Michael Julian Daneman, Mei-Lin Chan, Martin Lim, Fariboz Assaderaghi, Erhan Polatkan Ata
  • Patent number: 9344808
    Abstract: A MEMS device includes a first plate coupled to a second plate and a fixed third plate formed on a first substrate. The first and second plates are displaced in the presence of an acoustic pressure differential across the surfaces of the first plate. The MEMS device also includes a first electrode formed on the third plate and a second electrode formed on the second substrate. The first, second plate, and third plates are contained in an enclosure formed by a first and second substrates. The device includes an acoustic port to expose the first plate to the environment. The MEMS device also includes a first gap formed between the second and third plates and a second gap formed between the second plate and the second electrode. The displacement of the second plate causes the first gap to change inversely to the second gap.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: May 17, 2016
    Assignee: INVENSENSE, INC.
    Inventors: Mei-Lin Chan, Michael Julian Daneman, Erhan Polatkan Ata, Xiang Li, Martin Lim
  • Publication number: 20160083247
    Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.
    Type: Application
    Filed: December 2, 2015
    Publication date: March 24, 2016
    Inventors: Michael Julian Daneman, Mei-Lin Chan, Martin Lim, Fariboz Assaderaghi, Erhan Polatkan Ata
  • Publication number: 20160068386
    Abstract: A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 10, 2016
    Inventors: Mei-Lin Chan, Xiang Li, Martin Lim
  • Patent number: 9227842
    Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: January 5, 2016
    Assignee: INVENSENSE, INC.
    Inventors: Michael Julian Daneman, Mei-Lin Chan, Martin Lim, Fariboz Assaderaghi, Erhan Polatkan Ata
  • Patent number: 9216897
    Abstract: A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: December 22, 2015
    Assignee: INVENSENSE, INC.
    Inventors: Mei-Lin Chan, Xiang Li, Martin Lim
  • Publication number: 20150266723
    Abstract: A MEMS device includes a first plate coupled to a second plate and a fixed third plate formed on a first substrate. The first and second plates are displaced in the presence of an acoustic pressure differential across the surfaces of the first plate. The MEMS device also includes a first electrode formed on the third plate and a second electrode formed on the second substrate. The first, second plate, and third plates are contained in an enclosure formed by a first and second substrates. The device includes an acoustic port to expose the first plate to the environment. The MEMS device also includes a first gap formed between the second and third plates and a second gap formed between the second plate and the second electrode. The displacement of the second plate causes the first gap to change inversely to the second gap.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 24, 2015
    Applicant: InvenSense, Inc.
    Inventors: Mei-Lin CHAN, Michael Julian DANEMAN, Erhan Polatkan ATA, Xiang LI, Martin LIM
  • Publication number: 20140361388
    Abstract: A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.
    Type: Application
    Filed: November 27, 2013
    Publication date: December 11, 2014
    Applicant: Invensense, Inc.
    Inventors: Mei-Lin Chan, Xiang Li, Martin Lim
  • Publication number: 20140239353
    Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.
    Type: Application
    Filed: November 19, 2013
    Publication date: August 28, 2014
    Applicant: Invensense, Inc.
    Inventors: Michael Julian Daneman, Mei-Lin Chan, Martin Lim, Fariboz Assaderaghi, Erhan Polatkan Ata
  • Patent number: 7944779
    Abstract: A multifunction time display device includes a main body, a first element, a second element, and an indication element. The main body includes a casing, and the casing possesses a transparent portion. The first element moves inside the casing as time goes by. The second element is removably attached to any position of the transparent portion of the casing. The indication element is triggered when the first element moves to overlap the second element.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: May 17, 2011
    Assignee: Pegatron Corporation
    Inventors: Chia-Ying Lee, Yen-Chiu Hsu, Ai-Ling Lu, Mei-Lin Chan
  • Publication number: 20100074061
    Abstract: A multifunction time display device includes a main body, a first element, a second element, and an indication element. The main body includes a casing, and the casing possesses a transparent portion. The first element moves inside the casing as time goes by. The second element is removably attached to any position of the transparent portion of the casing. The indication element is triggered when the first element moves to overlap the second element.
    Type: Application
    Filed: September 24, 2009
    Publication date: March 25, 2010
    Applicant: PEGATRON CORPORATION
    Inventors: Chia-Ying Lee, Yen-Chiu Hsu, Ailing Lu, Mei-Lin Chan