Patents by Inventor Mei-Ling Chu

Mei-Ling Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition and uses of the same
    Patent number: 8734950
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1?m2?3.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: May 27, 2014
    Assignee: Taiwan Union Technology Corporation
    Inventors: Hsien-Te Chen, Mei-Ling Chu, Tsung-Hsien Lin, Chih-Wei Liao
  • EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USNG THE SAME
    Publication number: 20130306357
    Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.
    Type: Application
    Filed: July 26, 2013
    Publication date: November 21, 2013
    Applicant: Taiwan Union Technology Corporation
    Inventors: Hsuan Hao HSU, Jiun Jie HUANG, Mei Ling CHU, Hsien Te CHEN
  • RESIN COMPOSITION AND USES OF THE SAME
    Publication number: 20120263955
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1?m2?3.
    Type: Application
    Filed: June 15, 2011
    Publication date: October 18, 2012
    Inventors: Hsien-Te Chen, Mei-Ling Chu, Tsung-Hsien Lin, Chih-Wei Liao
  • EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20120024580
    Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.
    Type: Application
    Filed: November 1, 2010
    Publication date: February 2, 2012
    Inventors: Hsuan Hao HSU, Jiun Jie Huang, Mei Ling Chu, Hsien Te Chen
  • Method and system for estimating microelectronic fabrication product yield
    Patent number: 6909931
    Abstract: Within a method for estimating a microelectronic fabrication product yield and a system for estimating the microelectronic fabrication product yield there is employed a specific mathematic algorithm for estimating yield of a new microelectronic fabrication product within at least one microelectronic fabrication facility. The specific algorithm is solved incident to parametric data correlation with existing production data within the at least one microelectronic fabrication facility.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: June 21, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yun-Wei Liao, Regina Ka, Mei-Ling Chu
  • Method and system for estimating microelectronic fabrication product yield
    Publication number: 20030225475
    Abstract: Within a method for estimating a microelectronic fabrication product yield and a system for estimating the microelectronic fabrication product yield there is employed a specific mathematic algorithm for estimating yield of a new microelectronic fabrication product within at least one microelectronic fabrication facility. The specific algorithm is solved incident to parametric data correlation with existing production data within the at least one microelectronic fabrication facility.
    Type: Application
    Filed: June 4, 2002
    Publication date: December 4, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yun-Wei Liao, Regina Ka, Mei-Ling Chu