Patents by Inventor Mei Ling Lye

Mei Ling Lye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8900659
    Abstract: The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: December 2, 2014
    Assignee: National University of Signapore
    Inventors: Hua Chun Zeng, Shengmao Zhang, Yu Chang, Mei Ling Lye
  • Publication number: 20130118775
    Abstract: The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.
    Type: Application
    Filed: July 19, 2011
    Publication date: May 16, 2013
    Applicant: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Hua Chun Zeng, Shengmao Zhang, Yu Chang, Mei Ling Lye