Patents by Inventor Mei Po LEUNG

Mei Po LEUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonder and a method of cleaning a bond collet
    Patent number: 9318362
    Abstract: A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: April 19, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Mei Po Leung, Wing Yin Lee, Chi Ming Chong
  • DIE BONDER AND A METHOD OF CLEANING A BOND COLLET
    Publication number: 20150187617
    Abstract: A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.
    Type: Application
    Filed: December 22, 2014
    Publication date: July 2, 2015
    Inventors: Mei Po LEUNG, Wing Yin LEE, Chi Ming CHONG