Patents by Inventor MEI PO YEUNG

MEI PO YEUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate support for plasma etch operations
    Patent number: 10593521
    Abstract: Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: March 17, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Larry Frazier, Cheng-Hsiung Matthew Tsai, John C. Forster, Mei Po Yeung, Michael S. Jackson
  • SUBSTRATE SUPPORT FOR PLASMA ETCH OPERATIONS
    Publication number: 20140262043
    Abstract: Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: LARRY FRAZIER, CHENG-HSIUNG MATTHEW TSAI, JOHN C. FORSTER, MEI PO YEUNG, MICHAEL S. JACKSON