Abstract: Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: Aspects of the present disclosure disclose a component module in a process condition measuring device comprises a support for supporting a component, one or more legs configured to suspend the support in a spaced-apart relationship with respect to a substrate. An electrically conductive or low-resistivity semiconductor enclosure is configured to enclose the component, the support and the legs between the substrate and the enclosure. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.

Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.

Abstract: A ball inflation valve includes a valve body extended into an inflatable inner bladder of a ball and having an axial bore and an annular flange portion; a valve core partially held in the axial bore of the valve body and having an air hole; a canvas superimposing layer flatly superimposed on the annular flange portion of the valve body to locate around the valve core; and a protective top including a sleeve portion enclosing a length of the valve core exposed from the valve body and a locating flange portion radially outward extended from the sleeve portion to locate between a surface cover of the ball and the valve body and the valve core, so that any sulfide from the valve body and the valve core will attach to an inner side of the protective top without forming a yellowing smudge on the ball surface cover.

Abstract: A ball inflation valve includes a valve body extended into an inflatable inner bladder of a ball and having an axial bore and an annular flange portion; a valve core partially held in the axial bore of the valve body and having an air hole; a canvas superimposing layer flatly superimposed on the annular flange portion of the valve body to locate around the valve core; and a protective top including a sleeve portion enclosing a length of the valve core exposed from the valve body and a locating flange portion radially outward extended from the sleeve portion to locate between a surface cover of the ball and the valve body and the valve core, so that any sulfide from the valve body and the valve core will attach to an inner side of the protective top without forming a yellowing smudge on the ball surface cover.

Abstract: A measurement unit comprising a light source and a photodetector may be formed in a cavity in a substrate. The light source produces light that impinges a material layer and is reflected back to the photodetector. Through methods such as interferometry and ellipsometry, the thickness of the material layer may be calculated from the light intensity data measured by the photodetector. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: The subject invention concerns materials and methods for inhibiting the Akt/PKB pathway. In one embodiment, a compound of the invention inhibits kinase activity and/or phosphorylation levels of Akt proteins. The subject invention also concerns methods for inhibiting or killing a cancer cell or other cell in which expression of an Akt protein is elevated or constitutively active, comprising contacting the cell with an effective amount of a compound of formula I. The subject invention also concerns methods for treating cancer or a tumor in a person or animal comprising administering an effective amount of a compound of formula I to the person or animal.

Abstract: A sensor apparatus for measuring characteristics of optical radiation has a substrate and a low profile spectrally selective detection system located within the substrate at one or more spatially separated locations. The spectrally selective detection system includes a generally laminar array of wavelength selectors optically coupled to a corresponding array of optical detectors. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.

Abstract: A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.

Abstract: The subject invention concerns materials and methods for inhibiting the Akt/PKB pathway. In one embodiment, a compound of the invention inhibits kinase activity and/or phosphorylation levels of Akt proteins. The subject invention also concerns methods for inhibiting or killing a cancer cell or other cell in which expression of an Akt protein is elevated or constitutively active, comprising contacting the cell with an effective amount of a compound of formula I. The subject invention also concerns methods for treating cancer or a tumor in a person or animal comprising administering all effective amount of a compound of formula I to the person or animal.

Abstract: An integrated circuit structure is disclosed. The integrated circuit structure includes a first package substrate including a radiating element, the radiating element having a radiating element connection extending from the radiating element. The integrated circuit structure further includes a first chip positioned adjacent to the radiating element connection, the first chip having a first chip connection on a surface of the first chip, wherein the first chip connection forms a capacitive coupling with the radiating element connection. A method of forming an integrated circuit structure is also disclosed.

Abstract: A sensor wafer may be configured for in-situ measurements of parameters during an etch process. The sensor wafer may include a substrate, a cover, and one or more components positioned between the substrate and the cover. An etch-resistant coating is formed on one or more surfaces of the cover and/or substrate. The coating is configured to resist etch processes that etch the cover and/or substrate for a longer period than standard thin film materials of the same or greater thickness than the protective coating.

Abstract: A grid array antenna configured to operate with millimetre wavelength signals, the grid array antenna comprising a plurality of mesh elements and at least one radiation element; each mesh element comprising at least one long side and at least one short side operatively connected to the at least one long side; at least one of: the at least one radiating element, the at least one short side, and the at least one long side having compensation for improved antenna output for improved antenna radiation.

Abstract: A stitch-free football structure includes a ball bladder formed by providing a yarn layer on an outer surface of an inflatable bladder and a glue layer on an outer side of the yarn layer, and a prolate-spheroidal structure formed by adjoining curved panels having configuration corresponding to the ball bladder and glued to an outer side of the glue layer; and a lacing-shaped patch glued to a seam between two adjoining curved panels to meet a required football configuration. In a method of manufacturing the stitch-free football structure, a plurality of curved panels is prepared in advance by hot press molding, and the curved panels are joined and attached to a ball bladder by gluing. Thus, the procedures for manufacturing a football are simplified, the bad yield in manufacturing is reduced, and the produced football is more durable for use, has more precise dimensions, and beautiful and even exterior appearance.

Abstract: A ball inner bladder structure, particularly suitable for a seamless ball, includes a bladder in the form of a spherical bag, a yarn layer enclosing the bladder, an emulsion layer applied over the yarn layer, and a ball cover layer bonded to the emulsion layer. The yarn layer is an integrally knitted web structure having a 3D spherical shape. Knitted yarns subjected to pressure can displace relative to one another to finely adjust a surface configuration of the web structure for the same to completely bear against the bladder. The emulsion layer fills up voids on the yarn layer to provide a smooth spherical surface. The specifically knitted yarn layer can effectively control an expansion degree of the bladder when the same is inflated. And, expansion or compression pressure applied to the bladder is uniformly distributed over interlocking points of knitted yarns, preventing the bladder from deformation and breaking.

Abstract: A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the surface of the substrate. Sensor electronics are embedded into the substrate and coupled to the collector portion. When the substrate surface is exposed to a plasma one or more signals resulting from the plasma can be measured with the sensor(s).

Abstract: An integrated circuit structure is disclosed. The integrated circuit structure includes a first package substrate including a radiating element, the radiating element having a radiating element connection extending from the radiating element. The integrated circuit structure further includes a first chip positioned adjacent to the radiating element connection, the first chip having a first chip connection on a surface of the first chip, wherein the first chip connection forms a capacitive coupling with the radiating element connection. A method of forming an integrated circuit structure is also disclosed.

Abstract: A seamless ball structure, particularly suitable for balls used in different ball games, such as soccer, volleyball and basketball, includes an inner bladder, and an inner yarn layer, an emulsion layer and an outer cover layer sequentially provided on an outer surface of the inner bladder from inner to outer side. The emulsion layer inwardly permeates into voids among the yarns of the inner yarn layer. The outer cover layer is attached at an inner fabric layer thereof to an outer surface of the emulsion layer. The emulsion layer being heated and pressurized is in an adhering state to sufficiently tightly attach to the inner yarn layer and the outer cover layer, giving the ball so formed an increased structural strength. The ball can be easily and quickly manufactured at reduced manufacturing cost to thereby provide an improved ball structure that does not require any sewing with threads.