Patents by Inventor Mei-Yee Shek Le

Mei-Yee Shek Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bi-layer approach for a hermetic low dielectric constant layer for barrier applications
    Patent number: 7091137
    Abstract: Methods and apparatus are provided for processing a substrate with a bilayer barrier layer. In one aspect, the invention provides a method for processing a substrate including depositing a nitrogen containing barrier layer on a substrate surface and then depositing a nitrogen free barrier layer thereon. The barrier layer may be deposited over dielectric materials, conductive materials, or both. The bilayer barrier layer may also be used as an etch stop, an anti-reflective coating, or a passivation layer.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: August 15, 2006
    Assignee: Applied Materials
    Inventors: Albert Lee, Annamalai Lakshmanan, Bok Hoen Kim, Li-Qun Xia, Mei-Yee Shek Le