Patents by Inventor Mei-Yen SU

Mei-Yen SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11988686
    Abstract: A vertical probe card and a fence-like probe thereof are provided. The fence-like probe has a probe length within a range from 5 mm to 8 mm. The fence-like probe includes a fence-like segment, a ceramic layer, a connection segment, and a testing segment. The fence-like segment has an elongated shape defining a longitudinal direction, and the fence-like segment has a penetrating slot that is formed along the longitudinal direction and that has a length greater than 65% of the probe length. The ceramic layer is directly formed on an outer surface of the fence-like segment and covers two long walls of the penetrating slot. The connection segment and the testing segment are respectively connected to two end portions of the fence-like segment, and is not formed on the connection segment and the testing segment.
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: May 21, 2024
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Wei-Jhih Su, Chao-Hui Tseng, Hao-Yen Cheng, Mei-Hui Chen
  • Patent number: 11041774
    Abstract: A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 22, 2021
    Assignee: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventors: Ming-Te Tu, Chiung-Yueh Tien, Cheng-Yao Chang, Mei-Yen Su
  • Publication number: 20190265118
    Abstract: A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.
    Type: Application
    Filed: March 16, 2018
    Publication date: August 29, 2019
    Inventors: Ming-Te TU, Chiung-Yueh TIEN, Cheng-Yao CHANG, Mei-Yen SU