Patents by Inventor Mei-Yi Wu

Mei-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200259058
    Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Yi WU, Lu-Ming LAI, Yu-Ying LEE, Yung-Yi CHANG
  • Patent number: 10686105
    Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: June 16, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Yi Wu, Ying-Chung Chen, Hsin-Ying Ho
  • Patent number: 10665765
    Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: May 26, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
  • Publication number: 20200135579
    Abstract: In an embodiment, a method includes: forming a first fin extending from a substrate; forming a second fin extending from the substrate, the second fin being spaced apart from the first fin by a first distance; forming a metal gate stack over the first fin and the second fin; depositing a first inter-layer dielectric over the metal gate stack; and forming a gate contact extending through the first inter-layer dielectric to physically contact the metal gate stack, the gate contact being laterally disposed between the first fin and the second fin, the gate contact being spaced apart from the first fin by a second distance, where the second distance is less than a second predetermined threshold when the first distance is greater than or equal to a first predetermined threshold.
    Type: Application
    Filed: September 11, 2019
    Publication date: April 30, 2020
    Inventors: Shih-Chieh Wu, Pang-Chi Wu, Kuo-Yi Chao, Mei-Yun Wang, Hsien-Huang Liao, Tung-Heng Hsieh, Bao-Ru Young
  • Patent number: 10564608
    Abstract: One aspect of this disclosure relates to presenting a user with a stimulus to elicit user interaction with a task on a computing platform associated with the user. The stimulus may be presented on the computing platform when a set of triggering criteria is satisfied. The stimulus includes a task for the user to complete. The stimulus prompts the user to complete the task. The task includes a set of task criteria for completion. Responsive to the user satisfying the set of task criteria, the user is presented with one or more options to modify the stimulus. The user may be continuously prompted by the stimulus until the set of task criteria is satisfied.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: February 18, 2020
    Assignee: Disney Enterprises, Inc.
    Inventors: Xun Ma, Jian Fei Ouyang, Mei Shan Zhou, Hui Li, Ju-Hsin Chao, Hsin Yi Yueh, Brian Dai, Tong Yong Liu, Chen Hu Wu
  • Publication number: 20200020541
    Abstract: A method includes forming a metal gate structure, wherein the metal gate structure includes a gate dielectric layer and a gate electrode; performing a surface treatment to a top surface of the metal gate structure, wherein the surface treatment converts a top portion of the gate electrode to an oxidation layer; forming a conductive layer above the gate electrode, wherein the forming of the conductive layer includes substituting oxygen in the oxidation layer with a metallic element; and forming a contact feature above the metal gate structure, wherein the contact feature is in direct contact with the conductive layer.
    Type: Application
    Filed: July 16, 2018
    Publication date: January 16, 2020
    Inventors: Pang-Sheng Chang, Yu-Feng Yin, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang, Mei-Yun Wang, Feng-Yu Chang, Chen-Yuan Kao, Chia-Yang Hung, Chia-Sheng Chang, Shu-Huei Suen, Jyu-Horng Shieh, Sheng-Liang Pan, Jack Kuo-Ping Kuo, Shao-Jyun Wu
  • Publication number: 20190386187
    Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.
    Type: Application
    Filed: June 18, 2018
    Publication date: December 19, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Yi WU, Ying-Chung CHEN, Hsin-Ying HO
  • Publication number: 20190349464
    Abstract: One aspect of this disclosure relates to presenting a user with a stimulus to elicit user interaction with a task on a computing platform associated with the user. The stimulus may be presented on the computing platform when a set of triggering criteria is satisfied. The stimulus includes a task for the user to complete. The stimulus prompts the user to complete the task. The task includes a set of task criteria for completion. Responsive to the user satisfying the set of task criteria, the user is presented with one or more options to modify the stimulus. The user may be continuously prompted by the stimulus until the set of task criteria is satisfied.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 14, 2019
    Inventors: Xun Ma, Jian Fei Ouyang, Mei Shan Zhou, Hui Li, Ju-Hsin Chao, Hsin Yi Yueh, Brian Dai, Tong Yong Liu, Chen Hu Wu
  • Patent number: 10474947
    Abstract: An electronic device is provided. The electronic device comprises: a storage for storing interaction setting information and behavior setting information; an interaction interface; and a processor electrically connected to the storage and the interaction interface. When the processor receives a behavior-driving command from the interaction interface, the processor is configured to select the behavior setting information and the interaction setting information according to the behavior-driving command. The processor is configured to perform a behavior according to the behavior setting information. The processor is further configured to perform an interaction operation based on the behavior according to the behavior setting information and the interaction setting information when the behavior is had. A control method and a non-transitory computer readable storage medium are also provided.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: November 12, 2019
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Wei-Long Lee, Mei-Chieh Ku, Tzu-Yu Kung, Chung-Yi Wu, Tai-Yin Lin, Jia-Wei Chou, Chao-Yang Huang
  • Publication number: 20190187523
    Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, pixel units, and a light-shielding conductive pattern layer. The first substrate has a first inner surface and a first outer surface, and the first outer surface serves as a display surface of the display panel. The second substrate is disposed opposite to the first substrate and has a second inner surface and a second outer surface. The display medium layer is disposed between the first inner surface and the second inner surface. The pixel units are disposed between the display medium layer and the first inner surface, and at least one of the pixel units includes an active element. The light-shielding conductive pattern layer is disposed between the display medium layer and the second inner surface, at least partially overlaps the active element in a vertical projection direction, and includes a first patterned light-shielding conductive layer and a first patterned low-reflection layer.
    Type: Application
    Filed: November 8, 2018
    Publication date: June 20, 2019
    Applicant: Au Optronics Corporation
    Inventors: Bo-Ru Jian, Wei-Liang Chan, Chen-Yi Wu, Mei-Hui Lee, Chi-Hsiung Chang, Tai-Tso Lin
  • Publication number: 20180233643
    Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
    Type: Application
    Filed: January 2, 2018
    Publication date: August 16, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Yi WU, Lu-Ming LAI, Yu-Ying LEE, Yung-Yi CHANG
  • Publication number: 20170110426
    Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.
    Type: Application
    Filed: October 14, 2016
    Publication date: April 20, 2017
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
  • Publication number: 20070159341
    Abstract: A packaging structure for a radio frequency identification (RFID) device is disclosed which comprises a substrate, an antenna with a plurality of terminals formed on the substrate, a RFID chip with a plurality of signal pins electrically coupled to the plurality of terminals, respectively, and a plurality of thermally activated binding pads being electrically conductive and in contact with the plurality of signal pins, respectively, wherein the RFID chip is adhered to the substrate by the plurality of binding pads after a thermo-pressing process.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Inventors: Shun-Chi Chang, Guo-Tung Chiang, Chun-Ping Wu, Mei-Yi Wu, Cheng-Hsien Chou
  • Publication number: 20070159340
    Abstract: A structure for packaging a radio frequency identification (RFID) device is disclosed, which comprises a substrate, an antenna formed on the substrate, a RFID chip with a first side attached to the substrate and a second side having at least one signal pin exposed, at least one conductive contact plate placed on the substrate in contact with both the exposed signal pin and a portion of the antenna, and a protective film over the contact plate to secure the same to the substrate, wherein an electrical connection between the signal pin and the portion of the antenna is made through the contact plate.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Inventors: Kuo-Tung Chiang, Shun-Chi Chang, Chun-Ping Wu, Mei-Yi Wu, Cheng-Hsien Chou, Mong-Tai Yang, Min Wu