Patents by Inventor Mei-Yi Wu
Mei-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978664Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.Type: GrantFiled: July 29, 2022Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pang-Sheng Chang, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang, Mei-Yun Wang, Li-Chieh Wu, Chun-Wei Hsu
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Publication number: 20240139581Abstract: An electric treadmill includes a treadmill frame, an endless belt, a motor coupled to the endless belt for driving the endless belt to rotate, a brake device and a lifting device. The brake device has a rotating disc coaxially fixed to a motor shaft of the motor and a magnetic brake mechanism. The magnetic brake mechanism has at least one magnetic portion for applying a drag force against rotation of the rotating disc. The lifting device is operable to drive the magnetic brake mechanism to move between a first position where the magnetic portion is located close to the rotating disc and a second position where the magnetic portion is located away from the rotating disc. When there is no electric power supplied to the electric treadmill, the magnetic brake mechanism will automatically move to the first position due to gravity to stop rotation of the endless belt.Type: ApplicationFiled: January 2, 2024Publication date: May 2, 2024Inventors: Yung-Fa Wang, Mei-Yi Wu
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Patent number: 11944864Abstract: A motor brake device of an exercise apparatus includes a motor, a brake device and a lifting device. The brake device has a rotating disc and a magnetic brake mechanism. The rotating disc is coaxially mounted on a motor shaft of the motor. The magnetic brake mechanism has at least one magnetic portion. The lifting device is configured to drive the magnetic brake mechanism to move between a first position where the magnetic portion is located close to the rotating disc and a second position where the magnetic portion is located away from the rotating disc. The second position is located higher than the first position. When there is no electric power supplied to the exercise apparatus, the magnetic brake mechanism can move downward to the first position to stop rotation of the motor shaft by gravity due to potential difference between the second position and the first position.Type: GrantFiled: November 30, 2021Date of Patent: April 2, 2024Assignee: Johnson Health Tech Co., Ltd.Inventors: Yung-Fa Wang, Mei-Yi Wu
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Patent number: 11888081Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.Type: GrantFiled: April 9, 2021Date of Patent: January 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Yi Wu, Chang Chin Tsai, Bo-Yu Huang, Ying-Chung Chen
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Patent number: 11784296Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: GrantFiled: December 28, 2021Date of Patent: October 10, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
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Patent number: 11776862Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.Type: GrantFiled: September 21, 2020Date of Patent: October 3, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
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Publication number: 20220328713Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.Type: ApplicationFiled: April 9, 2021Publication date: October 13, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Chang Chin TSAI, Bo-Yu HUANG, Ying-Chung CHEN
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Publication number: 20220176196Abstract: A motor brake device of an exercise apparatus includes a motor, a brake device and a lifting device. The brake device has a rotating disc and a magnetic brake mechanism. The rotating disc is coaxially mounted on a motor shaft of the motor. The magnetic brake mechanism has at least one magnetic portion. The lifting device is configured to drive the magnetic brake mechanism to move between a first position where the magnetic portion is located close to the rotating disc and a second position where the magnetic portion is located away from the rotating disc. The second position is located higher than the first position. When there is no electric power supplied to the exercise apparatus, the magnetic brake mechanism can move downward to the first position to stop rotation of the motor shaft by gravity due to potential difference between the second position and the first position.Type: ApplicationFiled: November 30, 2021Publication date: June 9, 2022Inventors: Yung-Fa Wang, Mei-Yi Wu
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Publication number: 20220123192Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: ApplicationFiled: December 28, 2021Publication date: April 21, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
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Patent number: 11211536Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: GrantFiled: April 29, 2020Date of Patent: December 28, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
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Publication number: 20210013375Abstract: A semiconductor device package includes a carrier, a conductive pillar, an adhesive layer and a package body. The conductive pillar is disposed on the carrier. The conductive pillar has a top surface facing away from the carrier. The adhesive layer is disposed on the top surface of the conductive pillar. The package body is disposed on the carrier. The package body has a top surface facing away from the carrier. The top surface has a first portion and a second portion. The first portion and the second portion of the top surface of the package body are discontinuous.Type: ApplicationFiled: July 11, 2019Publication date: January 14, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Mei-Yi WU
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Publication number: 20210005522Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Han CHEN, Hsun-Wei CHAN, Mei-Yi WU
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Patent number: 10804173Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.Type: GrantFiled: October 14, 2016Date of Patent: October 13, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
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Publication number: 20200259058Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: ApplicationFiled: April 29, 2020Publication date: August 13, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Lu-Ming LAI, Yu-Ying LEE, Yung-Yi CHANG
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Patent number: 10686105Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.Type: GrantFiled: June 18, 2018Date of Patent: June 16, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Yi Wu, Ying-Chung Chen, Hsin-Ying Ho
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Patent number: 10665765Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: GrantFiled: January 2, 2018Date of Patent: May 26, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
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Publication number: 20190386187Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.Type: ApplicationFiled: June 18, 2018Publication date: December 19, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Ying-Chung CHEN, Hsin-Ying HO
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Publication number: 20180233643Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: ApplicationFiled: January 2, 2018Publication date: August 16, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Lu-Ming LAI, Yu-Ying LEE, Yung-Yi CHANG
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Publication number: 20170110426Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.Type: ApplicationFiled: October 14, 2016Publication date: April 20, 2017Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
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Publication number: 20070159340Abstract: A structure for packaging a radio frequency identification (RFID) device is disclosed, which comprises a substrate, an antenna formed on the substrate, a RFID chip with a first side attached to the substrate and a second side having at least one signal pin exposed, at least one conductive contact plate placed on the substrate in contact with both the exposed signal pin and a portion of the antenna, and a protective film over the contact plate to secure the same to the substrate, wherein an electrical connection between the signal pin and the portion of the antenna is made through the contact plate.Type: ApplicationFiled: January 9, 2007Publication date: July 12, 2007Inventors: Kuo-Tung Chiang, Shun-Chi Chang, Chun-Ping Wu, Mei-Yi Wu, Cheng-Hsien Chou, Mong-Tai Yang, Min Wu