Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.

Abstract: A vapor chamber structure includes an extruded aluminum case having a bottom plate and plural first separating units, an extruded aluminum cover combined with the extruded aluminum case correspondingly and having a top plate and plural second separating units, and a working fluid filled in an interior formed by the extruded aluminum case and the extruded aluminum cover. Each first separating unit includes plural first fins. A first groove is disposed between adjacent first fins. Each second separating unit includes plural second fins. A second groove is disposed between adjacent second fins. Each second separating unit is disposed between adjacent first separating units. The first grooves are individually interlaced with the adjacent second grooves. Thus, the heat exchange between the vaporized working fluid and the gas in adjacent grooves can be performed, which improves the efficiency of heat transfer.

Abstract: A vapor chamber having a composite supporting structure includes a flat sealed casing; a wick structure, a working fluid and a composite supporting structure. The composite supporting structure has a waved supporting rack and at least one supporting pillar. The waved supporting rack is configured to support upper and lower inner walls of the flat sealed casing. The waved supporting rack has plural separated channels for allowing vapor of the working fluid to flow through. Both ends of the at least one supporting pillar are respectively connected to the flat sealed casing or the wick structure. With this arrangement, compressive strength and tensile strength of the vapor chamber can be increased simultaneously without obstructing the circulation of liquid/vapor phases of the working fluid and reducing the thermal-conducting efficiency thereof.

Abstract: A method for forming a composite laminate includes: providing an upper die and a lower die; disposing the composite laminate over a die cavity of the lower die, and lowering the upper die onto the composite laminate and thereafter into the die cavity so as to hot press the composite laminate; folding inwardly a marginal end of the composite laminate that extends outwardly of the die cavity; removing the lower die from the upper die; and removing the upper die from the hot-pressed composite laminate.