Patents by Inventor Mei-Yu Chen

Mei-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240243119
    Abstract: A transient voltage suppression device includes at least one N-type lightly-doped structure, a first P-type well, a second P-type well, a first N-type heavily-doped area, and a second N-type heavily-doped area. The first P-type well and the second P-type well are formed in the N-type lightly-doped structure. The first N-type heavily-doped area and the second N-type heavily-doped area are respectively formed in the first P-type well and the second P-type well. The doping concentration of the first P-type well is higher than that of the second P-type well. The first P-type well and the second P-type well can be replaced with P-type lightly-doped wells respectively having P-type heavily-doped areas under the N-type heavily-doped areas.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Applicant: AMAZING MICROELECTRONIC CORP.
    Inventors: Chih-Wei CHEN, Kuan-Yu LIN, Mei-Lian FAN, KUN-HSIEN LIN
  • Publication number: 20170020026
    Abstract: A vapor chamber structure includes an extruded aluminum case having a bottom plate and plural first separating units, an extruded aluminum cover combined with the extruded aluminum case correspondingly and having a top plate and plural second separating units, and a working fluid filled in an interior formed by the extruded aluminum case and the extruded aluminum cover. Each first separating unit includes plural first fins. A first groove is disposed between adjacent first fins. Each second separating unit includes plural second fins. A second groove is disposed between adjacent second fins. Each second separating unit is disposed between adjacent first separating units. The first grooves are individually interlaced with the adjacent second grooves. Thus, the heat exchange between the vaporized working fluid and the gas in adjacent grooves can be performed, which improves the efficiency of heat transfer.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 19, 2017
    Inventors: George A. Meyer, IV, Hsin-Hua WEN, Ming-Kuei HSIEH, Chieh-Ping CHEN, Yu-Ju LIU, Mei-Yu CHEN, Hui-Ju HO
  • Publication number: 20110315351
    Abstract: A vapor chamber having a composite supporting structure includes a flat sealed casing; a wick structure, a working fluid and a composite supporting structure. The composite supporting structure has a waved supporting rack and at least one supporting pillar. The waved supporting rack is configured to support upper and lower inner walls of the flat sealed casing. The waved supporting rack has plural separated channels for allowing vapor of the working fluid to flow through. Both ends of the at least one supporting pillar are respectively connected to the flat sealed casing or the wick structure. With this arrangement, compressive strength and tensile strength of the vapor chamber can be increased simultaneously without obstructing the circulation of liquid/vapor phases of the working fluid and reducing the thermal-conducting efficiency thereof.
    Type: Application
    Filed: June 23, 2010
    Publication date: December 29, 2011
    Inventors: George Anthony. Meyer, IV, Chien-Hung Sun, Chieh-Ping Chen, Yung-Tai Lu, Te-Hsuan Chin, Mei-Yu Chen
  • Publication number: 20100308499
    Abstract: A method for forming a composite laminate includes: providing an upper die and a lower die; disposing the composite laminate over a die cavity of the lower die, and lowering the upper die onto the composite laminate and thereafter into the die cavity so as to hot press the composite laminate; folding inwardly a marginal end of the composite laminate that extends outwardly of the die cavity; removing the lower die from the upper die; and removing the upper die from the hot-pressed composite laminate.
    Type: Application
    Filed: October 13, 2009
    Publication date: December 9, 2010
    Applicant: ADVANCED INTERNATIONAL MULTITECH CO., LTD.
    Inventors: Mei-Yu Chen, Chang-Hung Tsai