Patents by Inventor Mei Zhen Ng

Mei Zhen Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMORY DEVICE HAVING A SWITCHING ELEMENT THICKER AT A FIRST SIDE THAN AT A SECOND SIDE AND METHOD OF FORMING THE SAME
    Publication number: 20230403953
    Abstract: A memory device may be provided, including a first planar electrode, a second planar electrode, and a switching element arranged between the first planar electrode and the second planar electrode to where a first side of the switching element is arranged over the first planar electrode and where a second side of the switching element is arranged under the second planar electrode. The switching element is thicker at the first side than the second side, and the switching element is configured to provide a conductive filament formation region.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 14, 2023
    Inventors: Ju Dy LIM, Mei Zhen NG, Kazutaka YAMANE, Chim Seng SEET
  • MEMORY DEVICE AND METHOD OF FORMING THE SAME
    Publication number: 20210057645
    Abstract: A memory device may be provided, including a first planar electrode, a second planar electrode, and a switching element arranged between the first planar electrode and the second planar electrode to where a first side of the switching element is arranged over the first planar electrode and where a second side of the switching element is arranged under the second planar electrode. The switching element is thicker at the first side than the second side, and the switching element is configured to provide a conductive filament formation region.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Inventors: Ju Dy LIM, Mei Zhen NG, Kazutaka YAMANE, Chim Seng SEET
  • Conductive paste, method for forming an interconnection and electrical device
    Patent number: 10202512
    Abstract: According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a composition including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: February 12, 2019
    Assignees: Nanyang Technologies University, Lockheed Martin Corporation
    Inventors: Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng, Alfred A. Zinn
  • CONDUCTIVE PASTE, METHOD FOR FORMING AN INTERCONNECTION AND ELECTRICAL DEVICE
    Publication number: 20180237644
    Abstract: According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a composition including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.
    Type: Application
    Filed: April 19, 2018
    Publication date: August 23, 2018
    Inventors: Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng, Alfred A. Zinn
  • Conductive paste, method for forming an interconnection and electrical device
    Patent number: 9976042
    Abstract: According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a composition including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: May 22, 2018
    Assignees: Nanyang Technological University, Lockheed Martin Corporation
    Inventors: Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng, Alfred A. Zinn
  • CONDUCTIVE PASTE, METHOD FOR FORMING AN INTERCONNECTION AND ELECTRICAL DEVICE
    Publication number: 20180002540
    Abstract: According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a cam-position including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.
    Type: Application
    Filed: January 29, 2016
    Publication date: January 4, 2018
    Inventors: Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng, Alfred A. Zinn