Patents by Inventor Mei-Fang Wang

Mei-Fang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6942099
    Abstract: A cushion package structure formed from a foldable material partially coated with an adhesive mainly comprises: a first plane, a second plane, a first bending side, a second bending side, an opening, an abutting plane, an adhesive plane, and an extensive body, etc. The cushion package structure may be integrally formed and manufactured as a blank, and the first bending side and the second bending are just straightened up while being used. After the packed object is placed from a side of the package structure, the abutting planes may surely abut against the packed object to fix the position thereof, such that the packed object won't be damaged by shaking. Since the cushion package structure 2 has protecting legs contacting all six surfaces of a virtual box surrounding the cushion package structure, so it is guaranteed that the structure is capable of anti-vibrating and positioning.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: September 13, 2005
    Assignee: Accton Technology Corporation
    Inventor: Mei-Fang Wang
  • Publication number: 20030072834
    Abstract: The present invention discloses a single mold structure for fabricating multiple external network adapters. The casing of the network adapter is produced by a single mold structure having multiple surface design of an interchangeable mold core. The interchangeable mold core can be replaced by another interchangeable mold core having different surface pattern during a manufacture interval. It can save a lot of time to change the mold core while producing and shorten a lot of time for creating molds during research and development stage. Finally, it can make the product come in more efficiently and can satisfy the customer requirement.
    Type: Application
    Filed: November 21, 2001
    Publication date: April 17, 2003
    Inventors: Chun-Chieh Wang, Mei-Fang Wang
  • Patent number: D471183
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: March 4, 2003
    Assignee: Accton Technology Corporation
    Inventors: Mei-Fang Wang, Chun-Chieh Wang
  • Patent number: D484872
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: January 6, 2004
    Assignee: Accton Technology Corporation
    Inventor: Mei-Fang Wang