Patents by Inventor Meiichi Ohta

Meiichi Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the composition
    Patent number: 6156427
    Abstract: An electromagnetic wave interference shield structure molded from an electroconductive resin composition for molding, which comprises columnar pellets of a specific length, made of a bundle of iron-based metal fibers as an essential component and at least one bundle of at least another kind of electroconductive fibers of different material in a different diameter than that of the iron-based metal fibers as independent electroconductive fiber-cores, coated with a thermoplastic resin having a specific range of heat distortion temperature continuously in the longitudinal direction has a stable and distinguished shield effect for a prolonged time.
    Type: Grant
    Filed: October 2, 1991
    Date of Patent: December 5, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Masao Gotoh, Makoto Iida, Kenichi Waragai, Meiichi Ohta, Susumu Iwai