Patents by Inventor Meiling Piao

Meiling Piao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR DETECTING RNA STRUCTURE AT WHOLE TRANSCRIPTOME LEVEL AND USE THEREOF
    Publication number: 20240052412
    Abstract: Provided in the present invention are a method for detecting an RNA structure and the use thereof. According to the present invention, the step of removing the background of reverse transcription termination signals is included in the method for detecting an RNA structure, and false positive signals in a structural score calculation are reduced, and therefore the accuracy of the detection method is improved.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 15, 2024
    Inventors: Qiangfeng ZHANG, Meiling PIAO
  • Motherboard to be cut
    Patent number: 10869396
    Abstract: In one embodiment, a motherboard to be cut, includes: a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein, a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided; each positional marker group includes a first marker assembly and a second marker assembly provided at both sides of the special-shaped cutting line section; and, in the arrangement direction of the first marker assembly and the second marker assembly, size of the first marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in, and size of the second marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: December 15, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Fuzheng Xie, Junshuo Li, Binfeng Feng, Xiaoxia Liu, Meiling Piao
  • Motherboard To Be Cut, Method Of Manufacturing Substrate And Method Of Detecting Cutting Accuracy Of Substrate
    Publication number: 20190159343
    Abstract: In one embodiment, a motherboard to be cut, includes: a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein, a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided; each positional marker group includes a first marker assembly and a second marker assembly provided at both sides of the special-shaped cutting line section; and, in the arrangement direction of the first marker assembly and the second marker assembly, size of the first marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in, and size of the second marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in.
    Type: Application
    Filed: May 2, 2018
    Publication date: May 23, 2019
    Inventors: Fuzheng Xie, Junshuo Li, Binfeng Feng, Xiaoxia Liu, Meiling Piao