Patents by Inventor Meir Chen

Meir Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7763826
    Abstract: A method and system for rigidly connecting a first metallic plate to a second metallic plate are provided. The first plate over the second plate, and a force is applied to at least one first location of the first plate using a clamping arrangement so as to tightly couple the first plate to the second plate in a proximity of the first location. Then, the beam source is caused to generate a beam to irradiate the first plate at the first location to produce a molten material. In this manner, at least one irradiated section of the first plate is melted throughout its thickness and rigidly connected to the second plate using the molten material. During the irradiation, the first plate and the clamping arrangement are translated with respect to one another to reach at least one second location. It is also possible to provide a bonding layer or a soldering layer between the first and second layers, which can be used to rigidly connect the first and second layers to one another.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: July 27, 2010
    Inventor: Meir Chen
  • Publication number: 20040262271
    Abstract: A method and system for rigidly connecting a first metallic plate to a second metallic plate are provided. The first plate over the second plate, and a force is applied to at least one first location of the first plate using a clamping arrangement so as to tightly couple the first plate to the second plate in a proximity of the first location. Then, the beam source is caused to generate a beam to irradiate the first plate at the first location to produce a molten material. In this manner, at least one irradiated section of the first plate is melted throughout its thickness and rigidly connected to the second plate using the molten material. During the irradiation, the first plate and the clamping arrangement are translated with respect to one another to reach at least one second location. It is also possible to provide a bonding layer or a soldering layer between the first and second layers, which can be used to rigidly connect the first and second layers to one another.
    Type: Application
    Filed: June 18, 2004
    Publication date: December 30, 2004
    Inventor: Meir Chen