Abstract: A device (10) and method for tranporting fluids across biological barriers enhances penetration of a biological barrier by the use of directional insertion, preferably with asymmetric microneedles (18) and/or microneedles (18) with sharp edges. Additionally, or alternatively, adhesion followed by alteration of contact geometry is employed to stretch the biological barrier across the microneedles (18), thereby also enhancing penetration. Also disclosed is a device (10) and method which combine shallow penetration by hollow microneedles (18) with jet injection via the microneedles (18) to achieve a total liquid penetration depth greater than the mechanical penetration depth of the microneedles (18).

Abstract: The present invention is a balloon angioplasty device which provides a combination of cutting elements to enhance dilation of an artery together with controlled drug delivery directed towards the regions of cutting. The invention is preferably implemented using rows of hollow microneedles to serve both as the cutting elements and the drug delivery conduits. The invention also provides a corresponding method in which a drug is delivered via conduits located within cutting elements around the exterior of a balloon angioplasty device during and/or immediately subsequent to inflation of the balloon within a blood vessel.

Abstract: A method for producing microneedles. The method including disposing a first layer of a radiation sensitive polymer on to a working surface and selectively irradiating the first layer such that the first layer has at least one irradiated region and at least one non-irradiated region. The method also including developing the first layer so as to selectively remove one of the at least one irradiated region and the at least one non-irradiated region such that, at least part of at least one remaining region at least partially defines a form of at least part of a microneedle structure. A microneedle structure including a plurality of microneedles at least partially formed from a radiation sensitive polymer.

Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.