Abstract: The present application relates to an LED bracket, a light-emitting unit and a light-emitting assembly. A substrate of the LED bracket comprises a substrate main body, and a supporting part extending from the substrate main body into a side wall of a bowl portion of the LED bracket, wherein the supporting part extends from one conductive area to the other conductive area in the side wall of the bowl portion of the LED bracket, and at least extends to a side wall area corresponding to an insulating area on the side wall that insulates and isolates the two conductive areas.

Abstract: The present application relates to a substrate, an LED light source assembly and manufacturing methods therefor. The substrate includes a first substrate and a second substrate which are arranged in a stacked manner. Electrode soldering regions on the front side of the first substrate and corresponding first conductive regions on the back side of the first substrate are electrically connected; and second conductive regions on the front side of the second substrate and corresponding third conductive regions on the back side of the second substrate are electrically connected, where the corresponding first conductive regions and the corresponding second conductive regions are electrically connected.

Abstract: A flip LED chip module and a method for manufacturing LED chip module are provided. In the manufactured flip LED chip module, the second glue layer for reducing light energy is formed on the front surface of each of the flip LED chips. Therefore, the difference between the light intensity of the light along the normal direction of the flip LED chip and the light intensity of the light at the four sides of the flip LED chip can be reduced, thus improving the uniformity of the color of the light. Hence, the color of the light of the LED device manufactured by the LED chip module can be more uniform, thus improving the quality of the LED device and the user satisfaction.

Abstract: Disclosed are a light-emitting means and a manufacturing method therefor, a lead frame (10), a support and a light-emitting device. A support forming region (11) in the lead frame (10) is internally provided with a supporting portion (12) and a lead portion (13) which extend from the main body of the lead frame (10), the supporting portion (12) comprises first and second supporting portions (121/122) arranged opposite to each other, the support forming region (11) is configured for forming a base body (20), and the supporting portion (12) is configured for being respectively embedded into a first outer side face (21) and a second outer side face (22) that are arranged opposite to each other on the formed base body (20). The supporting portions (12) on the lead frame (10) extend respectively into bayonets (23) provided merely on opposite side surfaces of an LED product, so as to fix six degrees of freedom of the LED product, improving the stability of the LED product when same is fixed.

Abstract: A LED support, an LED and a light-emitting device are provided. The LED support comprising a positive electrode substrate and a negative electrode substrate, an insulating enclosure body enclosing the positive electrode substrate and the negative electrode substrate. A front surface of each of the positive electrode substrate and the negative electrode substrate has a functional region and an enclosure contact region contacting the enclosure body. The functional region and the enclosure contact region of at least one substrate of the positive electrode substrate and the negative electrode substrate are not on the same plane, so that the path between the enclosure contact region and the functional region of the substrate may be extended, that is, the path for the moisture entering the functional region is extended, thereby improving the moisture resistance, reliability and durability of the LED support and the LED manufactured by the LED support.