Patents by Inventor Melanie Lutzke

Melanie Lutzke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
    Publication number: 20060032587
    Abstract: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.
    Type: Application
    Filed: October 18, 2005
    Publication date: February 16, 2006
    Inventors: Franz Hecht, Werner Kroninger, Melanie Lutzke
  • Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
    Patent number: 6972069
    Abstract: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: December 6, 2005
    Assignee: Infineon Technologies AG
    Inventors: Franz Hecht, Werner Kröninger, Melanie Lutzke
  • Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
    Publication number: 20030173017
    Abstract: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.
    Type: Application
    Filed: March 31, 2003
    Publication date: September 18, 2003
    Inventors: Franz Hecht, Werner Kroninger, Melanie Lutzke