Patents by Inventor Melanie R. Tuck

Melanie R. Tuck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contour mode resonators with acoustic reflectors
    Patent number: 7385334
    Abstract: A microelectromechanical (MEM) resonator is disclosed which has a linear or ring-shaped acoustic resonator suspended above a substrate by an acoustic reflector. The acoustic resonator can be formed with a piezoelectric material (e.g. aluminum nitride, zinc oxide or PZT), or using an electrostatically-actuated material. The acoustic reflector (also termed an acoustic mirror) uses alternating sections of a relatively low acoustic impedance ZL material and a relatively high acoustic impedance ZH material to isolate the acoustic resonator from the substrate. The MEM resonator, which can be formed on a silicon substrate with conventional CMOS circuitry, has applications for forming oscillators, rf filters, and acoustic sensors.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: June 10, 2008
    Assignee: Sandia Corporation
    Inventors: Roy H. Olsson, James G. Fleming, Melanie R. Tuck
  • Heat pipe with embedded wick structure
    Patent number: 5947193
    Abstract: A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: September 7, 1999
    Assignee: Sandia Corporation
    Inventors: Douglas Ray Adkins, David S. Shen, Melanie R. Tuck, David W. Palmer, V. Gerald Grafe
  • Heat pipe with embedded wick structure
    Patent number: 5769154
    Abstract: A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.
    Type: Grant
    Filed: January 29, 1996
    Date of Patent: June 23, 1998
    Assignee: Sandia Corporation
    Inventors: Douglas Ray Adkins, David S. Shen, Melanie R. Tuck, David W. Palmer, V. Gerald Grafe