Patents by Inventor Melanie Ring

Melanie Ring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7582909
    Abstract: An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: September 1, 2009
    Assignee: Infineon Technologies AG
    Inventors: Melanie Ring, Benjamin Prodinger, Werner Kuhlmann
  • Patent number: 7501585
    Abstract: A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: March 10, 2009
    Assignee: Infineon Technologies AG
    Inventors: Thomas Killer, Hans-Ludwig Althaus, Melanie Ring
  • Patent number: 7476906
    Abstract: The invention relates to a photodiode array comprising a photodiode and a submount, via which the photodiode is contacted, said photodiode and said submount being interlinked by eutectic bonding. The invention further relates to a method for establishing a link between a first semiconductor element and a second semiconductor element which have different outer contours, the two elements being interlinked by eutectic bonding when already being present as a wafer composite. The two interlinked wafers are subdivided one by one and independently of each other in accordance with the desired outer contour.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: January 13, 2009
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Robert Fürst, Mathias Kämpf, Melanie Ring, Frank Singer
  • Patent number: 7361936
    Abstract: An optical transmitting and/or receiving device has a semiconductor component with a first contact for connecting to a reference voltage and a second contact for obtaining or supplying a high-frequency electrical signal. There is also an electrically conducting carrier substrate with a first surface and a second surface. The semiconductor component is configured on the first surface of the carrier substrate. The second surface of the carrier substrate has a metallization that can be connected to a reference voltage applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate. The first contact of the semiconductor component is electrically connected to the first contacting region.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: April 22, 2008
    Assignee: Finisar Corporation
    Inventors: Daniel Reznik, Oliver Stier, Melanie Ring, Werner Kuhlmann, Benjamin Prodinger, Nicola Iwanowski
  • Publication number: 20060292717
    Abstract: An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).
    Type: Application
    Filed: June 9, 2006
    Publication date: December 28, 2006
    Inventors: Melanie Ring, Benjamin Prodinger, Werner Kuhlmann
  • Publication number: 20060166387
    Abstract: The invention relates to an optical transmitting and/or receiving device, having: a semiconductor component with a first contact for connection with a reference voltage and a second contact for applying or leading away a high-frequency electrical signal; an electrically conducting carrier substrate with a first surface and a second surface, the semiconductor component being arranged on the first surface of the carrier substrate, the second surface of the carrier substrate having a metallization which can be connected to the reference voltage, and the reference voltage being applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate, and the first contact of the semiconductor component being electrically connected to the first contacting region.
    Type: Application
    Filed: August 15, 2003
    Publication date: July 27, 2006
    Inventors: Daniel Reznik, Oliver Stier, Melanie Ring, Werner Kuhlmann, Benjamin Prodinger, Nicola Iwanowski
  • Publication number: 20050242447
    Abstract: A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.
    Type: Application
    Filed: January 26, 2005
    Publication date: November 3, 2005
    Applicant: Infineon Technologies AG
    Inventors: Thomas Killer, Hans-Ludwig Althaus, Melanie Ring
  • Publication number: 20050110025
    Abstract: The invention relates to a photodiode array comprising a photodiode and a submount, via which the photodiode is contacted, said photodiode and said submount being interlinked by eutectic bonding. The invention further relates to a method for establishing a link between a first semiconductor element and a second semiconductor element which have different outer contours, the two elements being interlinked by eutectic bonding when already being present as a wafer composite. The two interlinked wafers are subdivided one by one and independently of each other in accordance with the desired outer contour.
    Type: Application
    Filed: January 9, 2002
    Publication date: May 26, 2005
    Inventors: Robert Furst, Mathias Kampf, Melanie Ring, Frank Singer